SE1000W データシートの表示（PDF） - SiGe Semiconductor, Inc.
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SE1000W Datasheet PDF : 9 Pages
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Bondpad Diagram
SE1000W
LightChargerTM155 Mb/s Transimpedance Amplifier
Final
VCC2 1
VCC1 2
TZ_IN 3
Top
View
4
5
6
7
VEE2 ACGND VEE1 VEE1
10 VCC1
9 OUTP
8 OUTN
Bondpad Description
Pad No.
1
2
3
4
5
6
7
8
9
10
Name
VCC2
VCC1
TZ_IN
VEE2
ACGND
VEE1
VEE1
OUTN
OUTP
VCC1
Description
Positive supply (+5.0 V), front end circuitry only.
Positive supply (+5.0 V), pads 2 & 10 are connected on chip. Only one pad needs to
be bonded.
Input pad (connect to photodetector cathode).
Negative supply (0V) – Note this is separate ground for the input stage, which is AC
coupled on chip. There is no DC current through this pad.
Bond option: Connected to external capacitor to ground for single-ended operation
(recommended 1 nF); unconnected for differential operation.
Negative supply (0V), pads 6 & 7are connected on chip. Only one pad needs to be
bonded.
Negative supply (0V), pads 6 & 7 are connected on chip. Only one pad needs to be
bonded.
Negative differential voltage output; leave unconnected for single-ended operation.
Positive differential or single-ended voltage output.
Positive supply (+5.0 V), pads 2 & 10 are connected on chip. Only one pad needs to
be bonded.
40-DST-01 § Rev 1.5 § May 24/02
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