SGA-8343X データシートの表示（PDF） - Stanford Microdevices
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SGA-8343X Datasheet PDF : 9 Pages
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SGA-8343X Reliability Qualification Report
Group A1a
Test Conditions
Number of
Devices Under
Test
Group A1b
Test Conditions
Number of
Devices Under
Test
Group A2
Test Conditions
Temperature Cycling (Air to Air Thermal Shock) – Soldered on PCB
Temperature Range -65°C to 165°C, 10 min dwell, 1 minute transition,
1000 cycles
17
Test
JESD22-
Results Pass
Standard
A104(B)
Temperature Cycling (Air to Air Thermal Shock)
Temperature Range -65°C to 165°C, 10 min dwell, 1 minute transition,
1000 cycles
25
Test
JESD22-
Results PASS
Standard
A104(B)
High Temperature Operating Life Test
Junction Temperature = 150°C, Test Duration = 1000 hours
Number of
Devices Under
Test
Group B
Test Conditions
80
Test
JESD22-
Results PASS
Standard
A108(B)
HAST
Temperature = 110°C, 85% Relative Humidity, Test Duration = 264 hours
Number of
Devices Under
Test
Group C
Test Conditions
Number of
Devices Under
Test
15 (1)
Test
Standard
JESD22-
A110(B)
Results PASS
Autoclave
Temperature = 121°C, Relative Humidity = 100%, Test Duration = 96
hours
40
Test
JESD22-
Results PASS
Standard
A102(C)
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