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SRV05-4(2004) データシートの表示(PDF) - Semtech Corporation

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SRV05-4
(Rev.:2004)
Semtech
Semtech Corporation Semtech
SRV05-4 Datasheet PDF : 12 Pages
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SRV05-4
PROTECTION PRODUCTS
Applications Information (continued)
the reference voltage plus the VF drop of the diode.
For negative events, the bottom diode will be biased
when the voltage exceeds the VF of the diode. At first
approximation, the clamping voltage due to the charac-
teristics of the protection diodes is given by:
PIN Descriptions
VC = VCC + VF (for positive duration pulses)
VC = -VF
(for negative duration pulses)
However, for fast rise time transient events, the
effects of parasitic inductance must also be consid-
ered as shown in Figure 2. Therefore, the actual
clamping voltage seen by the protected circuit will be:
VC = VCC + VF + LP diESD/dt (for positive duration pulses)
VC = -VF - LG diESD/dt
(for negative duration pulses)
ESD current reaches a peak amplitude of 30A in 1ns
for a level 4 ESD contact discharge per IEC 61000-4-2.
Therefore, the voltage overshoot due to 1nH of series
inductance is:
Figure 1 - “Rail-To-Rail” Protection Topology
(First Approximation)
V = LP diESD/dt = 1X10-9 (30 / 1X10-9) = 30V
Example:
Consider a VCC = 5V, a typical VF of 30V (at 30A) for the
steering diode and a series trace inductance of 10nH.
The clamping voltage seen by the protected IC for a
positive 8kV (30A) ESD pulse will be:
VC = 5V + 30V + (10nH X 30V/nH) = 335V
This does not take into account that the ESD current is
directed into the supply rail, potentially damaging any
components that are attached to that rail. Also note
that it is not uncommon for the VF of discrete diodes to
exceed the damage threshold of the protected IC. This
is due to the relatively small junction area of typical
discrete components. It is also possible that the
power dissipation capability of the discrete diode will
be exceeded, thus destroying the device.
Figure 2 - The Effects of Parasitic Inductance
When Using Discrete Components to Implement
Rail-To-Rail Protection
The RailClamp is designed to overcome the inherent
disadvantages of using discrete signal diodes for ESD
suppression. The RailClamp’s integrated TVS diode
Figure 3 - Rail-To-Rail Protection Using
RailClamp TVS Arrays
2004 Semtech Corp.
6
www.semtech.com

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