HMC313(V02) データシートの表示（PDF） - Hittite Microwave
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HMC313 Datasheet PDF : 6 Pages
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MICROWAVE CORPORATION
v02.0703
HMC313
GaAs InGaP HBT MMIC BROADBAND
AMPLIFIER GAIN BLOCK, DC - 6.0 GHz
Evaluation PCB
8
List of Material
Item
Description
J1 - J2
PC Mount SMA Connector
U1
HMC313
PCB*
Evaluation PCB 1.5” x 1.5”
*Circuit Board Material: Roger 4350
The circuit board used in the final applicatin should use RF
circuit design techniques. Signal lines should have 50 ohm
impedance while the package ground leads should be con-
nected directly to the ground plane similar to that shown. A
sufficient number of via holes should be used to connect
the top and bottom ground planes. The evaluation circuit
board shown is available from Hittite upon request.
The “HMC313 Biasing and Impedance Matching Techniques” application note is located in the “Application Notes”
section of this Designers’ Guide.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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