W9751G8JB データシートの表示（PDF） - Winbond

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W9751G8JB

16M x 4 BANKS x 8 BIT DDR2 SDRAM

Winbond 

W9751G8JB

1. GENERAL DESCRIPTION

The W9751G8JB is a 512M bits DDR2 SDRAM, organized as 16,777,216 words  4 banks  8 bits.

This device achieves high speed transfer rates up to 1066Mb/sec/pin (DDR2-1066) for general

applications. W9751G8JB is sorted into the following speed grades: -18, -25, 25I and -3. The -18 is

compliant to the DDR2-1066 (7-7-7) specification. The -25/25I are compliant to the DDR2-800 (5-5-5)

or DDR2-800 (6-6-6) specification (the 25I industrial grade which is guaranteed to support -40°C ≤

TCASE ≤ 95°C). The -3 is compliant to the DDR2-667 (5-5-5) specification.

All of the control and address inputs are synchronized with a pair of externally supplied differential

clocks. Inputs are latched at the cross point of differential clocks (CLK rising and CLK falling). All

I/Os are synchronized with a single ended DQS or differential DQS- DQS pair in a source

synchronous fashion.

2. FEATURES

 Power Supply: VDD, VDDQ = 1.8 V  0.1 V

 Double Data Rate architecture: two data transfers per clock cycle

 CAS Latency: 3, 4, 5, 6 and 7

 Burst Length: 4 and 8

 Bi-directional, differential data strobes (DQS and DQS ) are transmitted / received with data

 Edge-aligned with Read data and center-aligned with Write data

 DLL aligns DQ and DQS transitions with clock

 Differential clock inputs (CLK and CLK )

 Data masks (DM) for write data.

 Commands entered on each positive CLK edge, data and data mask are referenced to both edges

of DQS

 Posted CAS programmable additive latency supported to make command and data bus efficiency

 Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)

 Off-Chip-Driver impedance adjustment (OCD) and On-Die-Termination (ODT) for better signal

quality

 Auto-precharge operation for read and write bursts

 Auto Refresh and Self Refresh modes

 Precharged Power Down and Active Power Down

 Write Data Mask

 Write Latency = Read Latency - 1 (WL = RL - 1)

 Interface: SSTL_18

 Packaged in WBGA 60 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant

Publication Release Date: Oct. 12, 2010

-4-

Revision A01

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