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BYW29-200 データシートの表示(PDF) - STMicroelectronics

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BYW29-200
ST-Microelectronics
STMicroelectronics ST-Microelectronics
BYW29-200 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
BYW29/F/FP/G-200
Fig.1 : Average forward power dissipation versus
average forward current.
PF(av)(W)
12
10
δ = 0.05 δ = 0.1 δ = 0.2
8
δ = 0.5
δ=1
6
4
T
2
IF(av)(A)
δ=tp/T
tp
0
0
1
2
3
4
5
6
7
8
9 10 11
Fig.2 : Peak current versus form factor.
IM(A)
160
140
120
P = 10W
IM
T
δ=tp/T
tp
100
80
60
40
P = 15W
20
P = 5W
δ
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Fig.3 : Forward voltage drop versus forward cur-
rent (maximum values).
IFM(A)
100.0
10.0
1.0
Tj=125°C
Tj=25°C
VFM(V)
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Fig.4-1 : Relative variation of thermal impedance
junction to case versus pulse duration (TO-220AC,
D2PAK).
Zth(j-c)/Rth(j-c)
1.0
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
0.1
1.E-03
1.E-02
tp(s)
T
1.E-01
δ=tp/T
tp
1.E+00
Fig.4-2 :Relative variation of thermal impedance
junction to case versus pulse duration
(TO-220FPAC, ISOWATT220AC).
Zth(j-c)/Rth(j-c)
1.0
δ = 0.5
δ = 0.2
δ = 0.1
0.1
Single pulse
0.0
1.E-03
1.E-02
tp(s)
1.E-01
T
δ=tp/T
1.E+00
tp
1.E+01
Fig.5-1 : Non repetitive surge peak forward current
versus overload duration (TO-220AC, D2PAK).
IM(A)
80
70
60
50
40
30
20
IM
10
0
1.E-03
t
δ=0.5
t(s)
1.E-02
1.E-01
Tc=25°C
Tc=75°C
Tc=120°C
1.E+00
3/7

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