CS5201-3GDP3 データシートの表示（PDF） - ON Semiconductor
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CS5201-3GDP3 Datasheet PDF : 8 Pages
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CS5201−3
MAXIMUM RATINGS
Parameter
Value
Unit
Supply Voltage, VIN
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Lead Temperature Soldering:
7.0
V
−40 to +70
°C
150
°C
−60 to +150 °C
Wave Solder (through hole styles only) (Note 1) 260 Peak
°C
Reflow (SMD styles only) (Note 2) 230 Peak
°C
ESD Damage Threshold (Human Body Model)
2.0
kV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. 10 second maximum.
2. 60 second maximum above 183°C.
ELECTRICAL CHARACTERISTICS (CIN = 10 mF, COUT = 22 mF Tantalum, VOUT + VDROPOUT < VIN < 7.0 V, 0°C ≤ TA ≤ 70°C,
TJ ≤ +150°C, unless otherwise specified, Ifull load = 1.0 A)
Characteristic
Test Conditions
Min
Typ
Max
Unit
Fixed Output Voltage
Reference Voltage (Notes 3 and 4)
Line Regulation
Load Regulation (Notes 3 and 4)
Dropout Voltage (Note 5)
Current Limit
Quiescent Current
Thermal Regulation (Note 6)
Ripple Rejection (Note 6)
Thermal Shutdown (Note 7)
VIN − VOUT = 1.5 V;
0 ≤ IOUT ≤ 1.0 A
2.0 V ≤ VIN − VOUT ≤ 3.7 V; IOUT = 10 mA
VIN − VOUT = 2.0 V; 10 mA ≤ IOUT ≤ 1.0 A
IOUT = 1.0 A
VIN − VOUT = 3.0 V
IOUT = 10 mA
30 ms Pulse, TA = 25°C
f = 120 Hz; IOUT = 1.0 A; VIN − VOUT = 3.0 V;
VRIPPLE = 1.0 VPP
−
3.250
(−1.5%)
−
−
−
1.0
−
−
−
150
3.300
0.02
0.04
1.0
3.1
5.0
0.002
80
180
3.350
(+1.5%)
0.20
0.4
1.2
−
10
0.020
−
V
%
%
V
A
mA
%/W
dB
210
°C
Thermal Shutdown Hysteresis (Note 7)
−
−
25
−
°C
3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output
voltage due to temperature changes must be taken into account separately.
4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package.
5. Dropout voltage is a measurement of the minimum input/output differential at full load.
6. Guaranteed by design, not 100% tested in production.
7. Thermal shutdown is 100% functionally tested in production.
PACKAGE PIN DESCRIPTION
Package Pin Number
TO−220−3 D2PAK−3 SOT−223
1
1
1
2
2
2
3
3
3
Pin Symbol
GND
Ground connection.
Function
VOUT
VIN
Regulated output voltage (case).
Input voltage.
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