AD826(RevB) データシートの表示（PDF） - Analog Devices
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AD826 Datasheet PDF : 14 Pages
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AD826
Parameter
Conditions
VS
Min Typ Max Unit
OUTPUT CHARACTERISTICS
Output Voltage Swing
Output Current
Short-Circuit Current
Output Resistance
RLOAD = 500 Ω
RLOAD = 150 Ω
RLOAD = 1 kΩ
RLOAD = 500 Ω
RLOAD = 500 Ω
Open Loop
±5 V
3.3 3.8
±V
±5 V
3.2 3.6
±V
± 15 V
13.3 13.7
±V
± 15 V
12.8 13.4
±V
0, +5 V
+1.5,
+3.5
V
± 15 V
50
mA
±5 V
50
mA
0, +5 V
30
mA
± 15 V
90
mA
8
Ω
MATCHING CHARACTERISTICS
Dynamic
Crosstalk
Gain Flatness Match
Slew Rate Match
DC
Input Offset Voltage Match
Input Bias Current Match
Open-Loop Gain Match
Common-Mode Rejection Ratio Match
Power Supply Rejection Ratio Match
f = 5 MHz
G = +1, f = 40 MHz
G = –1
TMIN –TMAX
TMIN –TMAX
VO = ± 10 V, RLOAD = 1 kΩ,
TMIN –TMAX
VCM = ± 12 V, TMIN–TMAX
± 5 V to ± 15 V, TMIN–TMAX
± 15 V
–80
± 15 V
0.2
± 15 V
10
± 5 V to ± 15 V
± 5 V to ± 15 V
0.5 2
0.06 0.8
± 15 V
± 15 V
0.15 0.01
80 100
80 100
dB
dB
V/µs
mV
µA
mV/V
dB
dB
POWER SUPPLY
Operating Range
Quiescent Current/Amplifier
Power Supply Rejection Ratio
Dual Supply
Single Supply
TMIN to TMAX
TMIN to TMAX
VS = ± 5 V to ± 15 V, TMIN to TMAX
±5 V
±5 V
± 15 V
± 15 V
± 2.5
+5
6.6
6.8
75 86
± 18 V
+36 V
7.5 mA
7.5 mA
7.5 mA
7.5 mA
dB
NOTES
1Full power bandwidth = slew rate/2 π VPEAK.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Internal Power Dissipation2
Plastic (N) . . . . . . . . . . . . . . . . . . . . . See Derating Curves
Small Outline (R) . . . . . . . . . . . . . . . . See Derating Curves
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . ± VS
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ± 6 V
Output Short Circuit Duration . . . . . . . See Derating Curves
Storage Temperature Range (N, R) . . . . . . . –65°C to +125°C
Operating Temperature Range . . . . . . . . . . –40°C to +85°C
Lead Temperature Range (Soldering 10 seconds) . . . +300°C
ESD SUSCEPTIBILITY
ESD (electrostatic discharge) sensitive device. Electrostatic charges
as high as 4000 volts, which readily accumulate on the human
body and on test equipment, can discharge without detection.
Although the AD826 features proprietary ESD protection cir-
cuitry, permanent damage may still occur on these devices
if they are subjected to high energy electrostatic discharges.
Therefore, proper ESD precautions are recommended to avoid
any performance degradation or loss of functionality.
2.0
8-LEAD MINI-DIP PACKAGE
TJ = +150؇C
1.5
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
1.0
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability .
2Specification is for device in free air: 8-lead plastic package, θJA = 100°C/watt;
8-lead SOIC package, θJA = 155°C/watt.
0.5
ORDERING GUIDE
8-LEAD SOIC PACKAGE
Model
Temperature Package
Range
Description
Package
Option
AD826AN
–40°C to +85°C 8-Lead Plastic DIP N-8
AD826AR
–40°C to +85°C 8-Lead Plastic SOIC SO-8
AD826AR-REEL7 –40°C to +85°C 7” Tape & Reel SOIC SO-8
AD826AR-REEL –40°C to +85°C 13” Tape & Reel SOIC SO-8
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE – ؇C
Maximum Power Dissipation vs. Temperature for Different
Package Types
REV. B
–3–
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