SFC05-4(2005) データシートの表示（PDF） - Protek Devices

部品番号

コンポーネント説明

メーカー

SFC05-4
(Rev.:2005)

FLIP CHIP ARRAY

Protek Devices 

SFC05-4

APPLICATION INFORMATION

PRINTED CIRCUIT BOARD RECOMMENDATIONS

PARAMETER

VALUE

Pad Size on PCB

Pad Shape

Pad Definition

Solder Mask Opening

Solder Stencil Thickness

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

Solder Paste Type

Pad Protective Finish

Tolerance - Edge To Corner Ball

Solder Ball Side Coplanarity

Maximum Dwell Time Above Liquidous (183°C)

Soldering Maximum Temperature

0.275mm

Round

Non-Solder Mask Defined Pads

0.325mm Round

0.150mm

0.330mm Round

No Clean

OSP(Entek Cu Plus 106A)

±50µm

±20µm

60 Seconds

270°C

REQUIREMENTS

Temperature:

TP for Lead-Free (SnAgCu): 260-265°C

TP for Tin-Lead: 240-245°C

Preheat time and temperature depends on solder paste and flux

activation temperature, component size, weight, surface area &

plating.

RECOMMENDED NON-SOLDER MASK

DEFINED PAD ILLUSTRATION

Non-Solder Mask Defined Pad

0.275mm DIA.

Solder Mask Opening

0.325mm DIA.

Solder Stencil Opening

0.330mm DIA.

TP

TL

TSMAX

TSMIN

05131.R6 4/05

Ramp-up

155°

TS - Preheat

140°

Ramp-down

t 25°C to Peak

30-60 seconds

Ramp-up

Solder Time Ramp-down

15 seconds 15-20 seconds

4

www.protekdevices.com

Share Link: