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HSDL-4230(1999) データシートの表示(PDF) - HP => Agilent Technologies

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HSDL-4230
(Rev.:1999)
HP
HP => Agilent Technologies HP
HSDL-4230 Datasheet PDF : 6 Pages
1 2 3 4 5 6
2
The package design of these
emitters is optimized for efficient
power dissipation. Copper
leadframes are used to obtain
better thermal performance than
the traditional steel leadframes.
The wide angle emitter, HSDL-
4220, is compatible with the IrDA
SIR standard and can be used
with the HSDL-1000 integrated
SIR transceiver.
Absolute Maximum Ratings
Parameter
Peak Forward Current
Average Forward Current
DC Forward Current
Power Dissipation
Reverse Voltage (IR = 100 µA)
Transient Forward Current (10 µs Pulse)
Operating Temperature
Storage Temperature
LED Junction Temperature
Lead Soldering Temperature
[1.6 mm (0.063 in.) from body]
Symbol
IFPK
IFAVG
IFDC
PDISS
VR
IFTR
TO
TS
TJ
Min.
Max.
500
Unit
mA
100
mA
100
mA
260
mW
5
V
1.0
A
0
70
°C
-20
85
°C
110
°C
260 for °C
5 seconds
Reference
[2], Fig. 2b
Duty Factor = 20%
Pulse Width = 100 µs
[2]
[1], Fig. 2a
[3]
Notes:
1. Derate linearly as shown in Figure 4.
2. Any pulsed operation cannot exceed the Absolute Max Peak Forward Current as specified in Figure 5.
3. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and
the wire bonds.
Electrical Characteristics at 25°C
Parameter
Forward Voltage
Symbol Min.
VF
1.30
Forward Voltage
Temperature Coefficient
V/T
Series Resistance
RS
Diode Capacitance
CO
Reverse Voltage
Thermal Resistance,
Junction to Pin
VR
2
Rθjp
Typ.
1.50
2.15
-2.1
-2.1
2.8
40
20
110
Max.
1.70
Unit
V
mV/ °C
ohms
pF
V
°C/W
Condition
IFDC = 50 mA
IFPK = 250 mA
IFDC = 50 mA
IFDC = 100 mA
IFDC = 100 mA
0 V, 1 MHz
IR = 100 µA
Reference
Fig. 2a
Fig. 2b
Fig. 2c

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