MXLCE17E3 データシートの表示（PDF） - Microsemi Corporation
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MXLCE17E3 Datasheet PDF : 5 Pages
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MLCE6.5 – MLCE170A
MAXIMUM RATINGS @ 25 ºC unless otherwise stated
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead (1)
Peak Pulse Power dissipation @ 25 ºC (at 10/1000 µs,
see Figures 1, 2, and 3) (2)
Rated Average Power Dissipation
Solder Temperature @ 10 s
TL = +40 ºC
TA = +25 ºC(1)
Symbol
TJ and TSTG
R ӨJL
P PP
P M(AV)
T SP
Value
-65 to +150
22
1500
5.0
1.52
260
Unit
ºC
ºC/W
W
W
oC
Notes:
1. At 3/8 inch (10 mm) from body, or 82 ºC/W junction to ambient when mounted on FR4 PC board with 4 mm2 copper pads (1oz), track width
1 mm, length 25mm.
2. With a impulse repetition rate of 0.01% or less. TVS devices are not typically used for dc power dissipation and are instead operated at
≤ VWM except for transients that briefly drive the device into avalanche breakdown (VBR to VC region) of the TVS element. Also see
Application Schematics for further protection details in rated peak power for unidirectional and bidirectional configurations respectively.
MECHANICAL and PACKAGING
• CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0.
• TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating. Solderable to MIL-STD-750, method 2026.
• MARKING: Part number.
• POLARITY: Cathode indicated by band.
• TAPE & REEL option: Standard per EIA-296 (add “TR” suffix to part number). Consult factory for quantities.
• WEIGHT: Approximately 1.5 grams.
• See Package Dimensions on last page.
Reliability Level
M
MA
MX
MXL
*(see High Reliability
Non-Hermetic Product
Portfolio)
Low Capacitance
Rated
PART NOMENCLATURE
M LC E 6.5 A e3
RoHS Compliance
e3 = RoHS Compliant
Blank = non-RoHS Compliant
Tolerance Level
A = +/- 5%
Blank = +/- 10%
Reverse Stand-Off Voltage
(see Electrical Characteristics
table)
Encapsulated Plastic Package
RF01009, Rev. B (5/7/13)
©2013 Microsemi Corporation
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