LSA676-R1S1-1 データシートの表示（PDF） - OSRAM GmbH
部品番号
コンポーネント説明
メーカー
LSA676-R1S1-1 Datasheet PDF : 15 Pages
| |||
LS A676, LA A676, LO A676, LY A676
Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
300
˚C
T 250
240 ˚C
217 ˚C
200
150
tS
100
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020D.01)
(acc. to J-STD-020D.01)
OHA04525
Tp 245 ˚C
tP
tL
50
25 ˚C
0
0
50
100
150
200
250
Anm.: Das Gehäuse ist nicht für nasschemische Reinigung geeignet.
Note: Package not suitable for wetcleaning.
s 300
t
Profile Feature
Pb-Free (SnAgCu) Assembly
Ramp-up Rate to Preheat*)
25°C to 150°C
Recommendation
2 K/ s
Max. Ratings
3K/s
Time ts from TSmin to TSmax
(150°C to 200°C
100 s
min. 60sec max. 120sec
Ramp-up Rate to Peak*)
180°C to TP
Liquidus Temperture TL
Time tL above TL
Peak Temperature TP
Time tP within 5°C of the specified
peak temperature TP - 5K
Ramp-down Rate*
TP to 100°C
Time 25°C to Peak temperature
2 K/ s
80 s
245 °C
20 s
3K/s
3K/s
217°C
max. 100 s
max. 250 °C
min. 10 s max. 30 s
6 K / s maximum
max. 8 min.
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation ∆T/∆t: ∆t max. 5 s; fulfillment for the whole T-range
2012-06-15
11
Share Link: 