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MSC8122(2006) データシートの表示(PDF) - Freescale Semiconductor

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MSC8122
(Rev.:2006)
Freescale
Freescale Semiconductor Freescale
MSC8122 Datasheet PDF : 88 Pages
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Features
Feature
Memory Controller
Multi-Channel DMA
Controller
Time-Division
Multiplexing (TDM)
Description
Flexible eight-bank memory controller:
• Three user-programmable machines (UPMs), general-purpose chip-select machine (GPCM), and a page-mode
SDRAM machine.
• Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash memory, and other user-definable
peripherals.
• Byte enables for either 64-bit or 32-bit bus width mode.
• Eight external memory banks (banks 0–7). Two additional memory banks (banks 9, 11) control IPBus
peripherals and internal memories. Each bank has the following features:
— 32-bit address decoding with programmable mask.
— Variable block sizes (32 KB to 4 GB).
— Selectable memory controller machine.
— Two types of data errors check/correction: normal odd/even parity and read-modify-write (RMW) odd/even
parity for single accesses.
— Write-protection capability.
— Control signal generation machine selection on a per-bank basis.
— Support for internal or external masters on the system bus.
— Data buffer controls activated on a per-bank basis.
— Atomic operation.
— RMW data parity check (on system bus only).
— Extensive external memory-controller/bus-slave support.
— Parity byte select pin, which enables a fast, glueless connection to RMW-parity devices (on the system bus
only).
— Data pipeline to reduce data set-up time for synchronous devices.
• 16 time-multiplexed unidirectional channels.
• Services up to four external peripherals.
• Supports DONE or DRACK protocol on two external peripherals.
• Each channel group services 16 internal requests generated by eight internal FIFOs. Each FIFO generates:
— A watermark request to indicate that the FIFO contains data for the DMA to empty and write to the destination.
— A hungry request to indicate that the FIFO can accept more data.
• Priority-based time-multiplexing between channels using 16 internal priority levels.
• Round-robin time-multiplexing between channels.
• A flexible channel configuration:
— All channels support all features.
— All channels connect to the system bus or local bus.
• Flyby transfers in which a single data access is transferred directly from the source to the destination without
using a DMA FIFO.
Up to four independent TDM modules, each with the following features:
• Optional operating configurations:
— Totally independent receive and transmit channels, each having one data line, one clock line, and one frame
sync line.
— Four data lines with one clock and one frame sync shared among the transmit and receive lines.
• Connects gluelessly to most T1/E1 framers as well as to common buses such as the ST-BUS.
• Hardware A-law/μ-law conversion.
• Up to 62.5 Mbps per TDM (62.5 MHz bit clock if one data line is used, 31.25 MHz if two data lines are used,
15.63 MHz if four data lines are used).
• Up to 256 channels.
• Up to 16 MB per channel buffer (granularity 8 bytes), where A/μ law buffer size is double (granularity 16 byte).
• Receive buffers share one global write offset pointer that is written to the same offset relative to their start
address.
• Transmit buffers share one global read offset pointer that is read from the same offset relative to their start
address.
• All channels share the same word size.
• Two programmable receive and two programmable transmit threshold levels with interrupt generation that can
be used, for example, to implement double buffering.
• Each channel can be programmed to be active or inactive.
• 2-, 4-, 8-, or 16-bit channels are stored in the internal memory as 2-, 4-, 8-, or 16-bit channels, respectively.
• The TDM Transmitter Sync Signal (TxTSYN) can be configured as either input or output.
• Frame Sync and Data signals can be programmed to be sampled either on the rising edge or on the falling edge
of the clock.
• Frame sync can be programmed as active low or active high.
• Selectable delay (0–3 bits) between the Frame Sync signal and the beginning of the frame.
• MSB or LSB first support.
MSC8122 Technical Data, Rev. 13
Freescale Semiconductor
v

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