MXSMBJ26A データシートの表示（PDF） - Microsemi Corporation
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MXSMBJ26A Datasheet PDF : 7 Pages
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MSMBG5.0A – MXLSMBG170CAe3,
MSMBJ5.0A – MXLSMBJ170CAe3
Available
600 Watt Surface Mount
Transient Voltage Suppressor
DESCRIPTION
The MSMB 5.0A – MSMB 170CA series of surface mount 600 watt transient voltage suppressors
provide a selection of standoff voltages (Vwm) from 5.0 to 170 V. These high-reliability devices are
available in either unidirectional or bidirectional versions. The SMBG Gull-wing design in the DO-
215AA package is ideal for visible solder connections. The SMBJ J-bend design in the DO-
214AA package allows for greater PC board mounting density. It is available with SnPb or
RoHS compliant matte-tin plating.
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• High reliability devices with wafer fabrication and assembly lot traceability.
• All devices 100% surge tested.
• Enhanced reliability screening in reference to MIL-PRF-19500 is also available.
Refer to High Reliability Up-Screened Plastic Products Portfolio for more details on the screening
options.
(See part nomenclature for all options.)
• Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B.
• 3σ lot norm screening performed on standby current (ID).
• RoHS compliant versions available.
APPLICATIONS / BENEFITS
• Protects sensitive components such as IC’s, CMOS, Bipolar, BiCMOS, ECL, DTL, T2L, etc.
• Protection from switching transients & RF induced voltage pulses.
• Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4.
• Secondary lightning protection per IEC61000-4-5 with 42 ohms source impedance:
Class 1: MSB 5.0A to MSMB 120CA
Class 2: MSMB 5.0A to MSMB 60CA
Class 3: MSMB 5.0A to MSMB 30CA
Class 4: MSMB 5.0A to MSMB 15CA
• Secondary lightning protection per IEC61000-4-5 with 12 ohms source impedance:
Class 1: MSMB 5.0A to MSMB 36CA
Class 2: MSMB 5.0A to MSMB 18CA
MAXIMUM RATINGS @ 25 ºC unless otherwise stated
Screening in
reference to
MIL-PRF-19500
available
DO-215AA
Gull-wing Package
DO-214AA
J-bend Package
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
Also available in:
Commercial Grade
SMBJ5.0A – SMBJ170CAe3
T-18 package
(axial-leaded)
P6KE6.8A – P6KE200CAe3
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance, Junction to Lead
Thermal Resistance, Junction to Ambient (1)
Peak Pulse Power Dissipation (2)
Rated Average Power Dissipation (1)
10/1000us
@ TL < 25 ºC
@ TA = 25 ºC
Tclamping (0 volts to V(BR) min)
Forward Surge Current (3)
Unidirectional
Bidirectional
Solder Temperature @ 10 s
Symbol
TJ and
TSTG
R ӨJL
R ӨJA
P PP
P M(AV)
IFS
TSP
Value
Unit
-65 to +150 oC
25
90
600
5
1.38
< 100
<5
100
260
oC/W
oC/W
W
W
ps
ns
A (pk)
oC
Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see pad layout on last page).
2. With impulse repetition rate (duty factor) of 0.01 % or less (also Figure 1 and 4).
3. Peak impulse of 8.3 ms half-sine wave (unidirectional only).
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
RF01000, Rev. C (1/4/13)
©2013 Microsemi Corporation
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