NUF8010MUT2G(2007) データシートの表示（PDF） - ON Semiconductor

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NUF8010MUT2G
(Rev.:2007)

Low Capacitance 8 Line EMI Filter with ESD Protection in UDFN Package

ON Semiconductor 

NUF8010MU

Low Capacitance 8 Line EMI

Filter with ESD Protection in

UDFN Package

This device is an 8 line EMI filter array for wireless applications.

Greater than -20 dB typical attenuation is obtained at frequencies from

800 MHz to 5.0 GHz. The NUF8010MU has a typical cut-off frequency

of 215 MHz. This UDFN package is specifically designed to enhance

EMI filtering for low-profile or slim design electronics especially where

space and height is a premium. It also offers ESD protection-clamping

transients from static discharges. ESD protection is provided across all

capacitors.

Features

•ăEMI Filtering and ESD Protection

•ăIntegration of 40 Discrete Components

•ăCompliance with IEC61000-4-2 (Level 4)

•ăUDFN Package, 1.2 x 3.5 mm, 0.4 mm Pitch

•ăMoisture Sensitivity Level 1

•ăESD Ratings: Machine Model = C

Human Body Model = 3B

•ăThis is a Pb-Free Device*

Benefits

•ăReduces EMI/RFI Emissions on a Data Line

•ăLow Profile Package; Typical Height of 0.5 mm

•ăDesign-Friendly and Easy-to-Use Pin Configurations,

Particularly for Portable Electronics

•ăIntegrated Solution Offers Cost and Space Savings in UDFN Package

•ăReduces Parasitic Inductances Which Offer a More “Ideal” Low Pass

Filter Response

•ăIntegrated Solution Improves System Reliability

Applications

•ăEMI Filtering and ESD Protection for Data Lines

•ăKeypad Interface and Protection for Portable Electronics

•ăBottom Connector Interface for Mobile Handsets

•ăNotebook Computers and Digital Cameras

•ăLCD Display Interface in Mobile Handsets

•ăCamera Display Interface in Mobile Handsets

http://onsemi.com

1

16

Cd Cd

2

15

Cd Cd

3

14

Cd Cd

4

13

Cd Cd

5

12

Cd Cd

6

11

Cd Cd

7

10

Cd Cd

8

9

Cd Cd

(Top View)

16

1

UDFN16

MU SUFFIX

CASE 517AF

MARKING

DIAGRAM

810 M

G

1

810 = Specific Device Code

M

= Date and Assembly Location

G

= Pb-Free Package

*For additional information on our Pb-Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

ORDERING INFORMATION

Device

Package

Shipping†

NUF8010MUT2G UDFN16 3000 / Tape & Reel

(Pb-Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

©Ă Semiconductor Components Industries, LLC, 2007

1

October, 2007 - Rev. 0

Publication Order Number:

NUF8010MU/D

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