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NUF8010MUT2G データシートの表示(PDF) - ON Semiconductor

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NUF8010MUT2G Datasheet PDF : 6 Pages
1 2 3 4 5 6
NUF8010MU
Table 1. FUNCTIONAL PIN DESCRIPTION
Filter
Device Pins
Filter 1
1 & 16
Filter 2
2 & 15
Filter 3
3 & 14
Filter 4
4 & 13
Filter 5
5 & 12
Filter 6
6 & 11
Filter 7
7 & 10
Filter 8
8&9
Ground Pad
GND
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
Filter + ESD Channel 5
Filter + ESD Channel 6
Filter + ESD Channel 6
Filter + ESD Channel 6
Ground
Description
MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
ESD Discharge IEC6100042
Contact Discharge
VPP
8.0
kV
Operating Temperature Range
TOP
40 to 85
°C
Storage Temperature Range
TSTG
55 to 150
°C
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Maximum Reverse Working Voltage
VRWM
5.0
V
Breakdown Voltage
VBR
IR = 1.0 mA
6.0
7.0
8.0
V
Leakage Current
IR
VRWM = 3.3 V
100
nA
Resistance
RA
IR = 20 mA
85
100
115
W
Diode Capacitance
Cd
VR = 2.5 V, f = 1.0 MHz
7
11
pF
Line Capacitance
CL
VR = 2.5 V, f = 1.0 MHz
14
18
pF
3 dB CutOff Frequency (Note 1)
f3dB
Above this frequency,
215
appreciable attenuation occurs
MHz
6 dB CutOff Frequency
f6dB
Above this frequency,
280
appreciable attenuation occurs
MHz
1. 50 W source and 50 W load termination.
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