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DDZX10C(2010) データシートの表示(PDF) - Diodes Incorporated.

部品番号
コンポーネント説明
メーカー
DDZX10C
(Rev.:2010)
Diodes
Diodes Incorporated. Diodes
DDZX10C Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Features
Very Sharp Breakdown Characteristics
300mW Power Dissipation on FR-4 PCB
Very Tight Tolerance on VZ
Ideally Suited for Automated Assembly Processes
Very Low Leakage Current
Lead, Halogen and Antimony Free, RoHS Compliant (Note 2)
"Green" Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
DDZX5V1B - DDZX43
SURFACE MOUNT PRECISION ZENER DIODE
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Mechanical Data
Case: SOT-23
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe.
Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Marking Information: See Page 6
Ordering Information: See Page 6
Weight: 0.008 grams (approximate)
Top View
Device Schematic
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ IF = 10mA
VF
0.9
V
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Value
300
417
-65 to +150
Unit
mW
°C/W
°C
Notes:
1. Device mounted on FR-4 PCB with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead. Halogen and Antimony Free.
3. Product manufactured with Data Code OW (week 42, 2009) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code OW are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DDZX5V1B - DDZX43
Document number: DS30408 Rev. 8 - 2
1 of 7
www.diodes.com
April 2010
© Diodes Incorporated

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