1646 データシートの表示（PDF） - THAT Corporation

部品番号

コンポーネント説明

メーカー

1646

Balanced Line Driver ICs

THAT Corporation 

Document 600078 Rev 05

Page 10 of 12

THAT1606/1646 Balanced Line Driver ICs

Package Information

Model

1646

1606

SO8

Pkg

DIP8

Pkg

SO16W

Pkg

QSOP16

Pkg

1646S08-U 1646P08-U 1646W16-U

—-

—-

—-

—-

1606Q16-U

Table 2. Order Number Information

The THAT1646 in available in 8-pin SO, 8-pin

mini-DIP and 16-pin wide SOIC packages. The 1606

comes in a 16-pin QSOP package Package dimen-

sions are shown in Figures 9, 10, 11, and 12, while

pinouts are given in Table 1.

Thermal Considerations

As mentioned. the 1646 is available in an 8-pin

DIP, and 16-pin wide SO, and an 8-pin SO, with junc-

tion-to-ambient thermal resistances of 100°C/watt,

80°C/watt, and 150°C/watt, respectively, assuming a

2-sided PCB with no ground planes. Users of the

SO-8 package should recognize driving 600 W loads

or very long cables (several hundred feet) at high am-

bient temperatures (above 55°C) continuously could

lead to internal die temperatures that exceed the

maximum rating and result in performance degrada-

tion.

The 1606 is supplied in a 16-pin QSOP package

in which pins 1, 8, 9, and 16 are fused to the die

paddle to assist in conducting heat away from the

die. These pins are connected to the die substrate,

which is, in turn, connected to the ground pin of the

device. When these pins are connected to a top-side

ground plane of 1 square inch area, the junc-

tion-to-ambient thermal resistance is 125°C/watt. In-

ternal planes on multi-layer PCBs will reduce the

thermal resistance further.

THAT Corporation; 45 Sumner Street; Milford, Massachusetts 01757-1656; USA

Tel: +1 (508) 478-9200; Fax: +1 (508) 478-0990; Web: www.thatcorp.com

Copyright © 2011, THAT Corporation; All rights reserved.

Share Link: