UG80486DX4WB75S データシートの表示（PDF） - Intel

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UG80486DX4WB75S

EMBEDDED WRITE-BACK ENHANCED IntelDX4™ PROCESSOR

Intel 

Contents

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Typical Loading Delay versus Load Capacitance under Worst-Case Conditions

for a Low-to-High Transition ..................................................................................................... 40

Typical Loading Delay versus Load Capacitance under Worst-Case Conditions

for a High-to-Low Transition ..................................................................................................... 40

Typical Loading Delay versus Load Capacitance in Mixed Voltage System ........................... 41

208-Lead SQFP Package Dimensions .................................................................................... 42

Principal Dimensions and Data for 168-Pin Grid Array Package ............................................. 43

TABLES

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

The Embedded Write-Back Enhanced IntelDX4™ Processor Family ....................................... 2

Pinout Differences for 208-Lead SQFP Package ...................................................................... 5

Pin Assignment for 208-Lead SQFP Package ........................................................................... 6

Pin Cross Reference for 208-Lead SQFP Package ................................................................... 8

Pinout Differences for 168-Pin PGA Package ......................................................................... 11

Pin Assignment for 168-Pin PGA Package .............................................................................. 12

Pin Cross Reference for 168-Pin PGA Package ...................................................................... 14

Embedded Write-Back Enhanced IntelDX4™ Processor Pin Descriptions ............................. 16

Output Pins .............................................................................................................................. 24

Input/Output Pins ..................................................................................................................... 24

Test Pins .................................................................................................................................. 25

Input Pins ................................................................................................................................. 25

CPUID Instruction Description ................................................................................................. 26

Boundary Scan Component Identification Code (Write-Through/Standard Bus Mode) ........... 28

Boundary Scan Component Identification Code (Write-Back/Enhanced Bus Mode) ............... 29

Absolute Maximum Ratings ..................................................................................................... 30

Operating Supply Voltages ...................................................................................................... 30

DC Specifications ..................................................................................................................... 31

ICC Values ................................................................................................................................ 32

AC Characteristics ................................................................................................................... 33

AC Specifications for the Test Access Port ............................................................................. 35

168-Pin Ceramic PGA Package Dimensions ........................................................................... 43

Ceramic PGA Package Dimension Symbols ........................................................................... 44

Thermal Resistance, θJA (°C/W) ............................................................................................. 45

Thermal Resistance, θJC (°C/W) ............................................................................................. 45

Maximum Tambient, TA max (°C) ............................................................................................... 45

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