MXSMBJSAC26E3 データシートの表示（PDF） - Microsemi Corporation
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MXSMBJSAC26E3 Datasheet PDF : 7 Pages
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MSMBJSAC5.0 – MSMBJSAC75(e3)
MAXIMUM RATINGS @ 25 ºC unless otherwise stated
Parameters/Test Conditions
Junction and Storage Temperature
Peak Pulse Power Dissipation @ 10/1000 µs (1)
Average Power Dissipation @ TL = +75 oC (2)
Clamping Speed (0 volts to V(BR) min, theoretical)
Solder Temperature @ 10 s
Symbol
TJ and TSTG
P PP
P M(AV)
t clamping
Value
-65 to +150
500
2.5
<5
260
Unit
oC
W
W
ns
oC
Notes:
1. With impulse repetition rate (duty factor) of 0.01 % max. TVS devices are not typically used for dc
power dissipation and are instead operated ≤ VWM (rated standoff voltage) except for transients that
briefly drive the device into avalanche breakdown (V(BR) to VC region) of the TVS element. Also see
Figures 5 and 6 for further protection details in rated peak pulse power for unidirectional and
bidirectional configurations respectively.
2. At 3/8 (10 mm) lead length from body.
MECHANICAL and PACKAGING
• CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0 requirements
• TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating readily solderable per MIL- STD-750, method 2026
• MARKING: Part number
• POLARITY: Cathode end banded
• TAPE & REEL option: Standard per EIA-481-1-A (add “TR” suffix to part number). Consult factory for quantities.
• WEIGHT: Approximately 0.1 grams
• See Package Dimensions on last page.
Reliability Level*
M
MA
MX
MXL
*(see Hirel Non-Hermetic
Product Portfolio)
Surface Mount Package
600 W Power Level
J-Bend Lead Form
PART NOMENCLATURE
M SM B J SAC 5.0 e3
RoHS Compliance
e3 = RoHS compliant
Blank = non-RoHS compliant
Stand-Off Voltage (VWM)
(see Electrical Characteristics
table)
Series ID
RF01021, Rev. B (8/15/13)
©2013 Microsemi Corporation
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