1.5SMC82A-CT7 データシートの表示（PDF） - Unspecified

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1.5SMC82A-CT7

Transient Voltage Suppression Diodes

Unspecified 

Transient Voltage Suppression Diodes

Surface Mount – 1500W > 1.5SMC series

1.5SMC Series

RoHS

Pb e3

Uni-directional

Bi-directional

Agency Approvals

AGENCY

AGENCY FILE NUMBER

E230531

Maximum Ratings and Thermal Characteristics

(TA=25OC unless otherwise noted)

Parameter

Symbol Value Unit

Peak Pulse Power Dissipation at

TA=25ºC by 10/1000µs Waveform

PPPM

1500

W

(Fig.2)(Note 1), (Note 2), (Note 5)

Power Dissipation on Infinite Heat

Sink at TL=50OC

PD

Peak Forward Surge Current, 8.3ms

Single Half Sine Wave (Note 3)

IFSM

Maximum Instantaneous Forward

Voltage at 100A for Unidirectional

VF

Only (Note 4)

Operating Temperature Range

TJ

Storage Temperature Range

TSTG

6.5

W

200

A

3.5/5.0 V

-65 to 150 °C

-65 to 175 °C

Typical Thermal Resistance Junction

to Lead

RθJL

15

°C/W

Typical Thermal Resistance Junction

to Ambient

RθJA

75

°C/W

Notes:

1. Non-repetitive current pulse , per Fig. 4 and derated above TJ (initial) =25OC per Fig. 3.

2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal.

3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional

device only, duty cycle=4 per minute maximum.

4. VF < 3.5V for single die parts and VF< 5.0V for stacked-die parts.

5. The PPPM of stacked-die parts is 2000W and please contact littelfuse for the detail

stacked-die parts.

Functional Diagram

Cathode

Bi-directional

Uni-directional

Anode

Descriptios

The 1.5SMC series is designed specifically to protect

sensitive electronic equipment from voltage transients

induced by lightning and other transient voltage events.

Features

• 1500W peak pulse power

capability at 10/1000μs

waveform, repetition rate

(duty cycles):0.01%

• Excellent clamping

capability

• Low incremental surge

resistance

• Typical IR less than 1μA

when VBR min>12V

• For surface mounted

applications to optimize

board space

• Low profile package

• Built-in strain relief

• Typical failure mode is

short from over-specified

voltage or current

• Whisker test is conducted

based on JEDEC

JESD201A per its table 4a

and 4c

• IEC-61000-4-2 ESD

30kV(Air), 30kV (Contact)

• ESD protection of data

lines in accordance with

IEC 61000-4-2

• EFT protection of data

lines in accordance with

IEC 61000-4-4

• Fast response time:

typically less than 1.0ps

from 0V to BV min

• Glass passivated chip

junction

• High temperature

to reflow soldering

guaranteed: 260°C/40sec

• VBR @ TJ= VBR@25°C

x (1+αT x (TJ - 25))

(αT:Temperature

Coefficient, typical value

is 0.1%)

• Plastic package is

flammability rated V-0 per

Underwriters Laboratories

• Meet MSL level1, per

J-STD-020, LF maximun

peak of 260°C

• Matte tin lead–free plated

• Halogen free and RoHS

compliant

• Pb-free E3 means 2nd

level interconnect is

Pb-free and the terminal

finish material is tin(Sn)

(IPC/JEDEC J-STD-

609A.01)

Applications

TVS devices are ideal for the protection of I/O Interfaces,

VCC bus and other vulnerable circuits used in Telecom,

Computer, Industrial and Consumer electronic

applications.

Additional Infomarion

Datasheet

Resources

Samples

© 2015 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 11/20/15

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