BGA2802(2011) データシートの表示（PDF） - NXP Semiconductors.

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BGA2802
(Rev.:2011)

MMIC wideband amplifier

NXP Semiconductors. 

NXP Semiconductors

BGA2802

MMIC wideband amplifier

3. Ordering information

Table 2. Ordering information

Type number Package

Name

Description

BGA2802

-

plastic surface-mounted package; 6 leads

Version

SOT363

4. Marking

Table 3. Marking

Type number

BGA2802

Marking code

MA*

Description

* = - : made in Hong Kong

* = p : made in Hong Kong

* = W : made in China

* = t : made in Malaysia

5. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter

Conditions

VCC

ICC

Ptot

Tstg

Tj

Pdrive

supply voltage

supply current

total power dissipation

storage temperature

junction temperature

drive power

RF input AC coupled

Tsp = 90 °C

6. Thermal characteristics

Min Max Unit

−0.5 3.6 V

-

55 mA

-

200 mW

−40 +125 °C

-

125 °C

-

−16.5 dBm

Table 5.

Symbol

Rth(j-sp)

Thermal characteristics

Parameter

Conditions

thermal resistance from junction to Ptot = 200 mW; Tsp = 90 °C

solder point

Typ Unit

300 K/W

7. Characteristics

Table 6. Characteristics

VCC = 3.3 V; ZS = ZL = 50 Ω; Pi = −40 dBm; Tamb = 25 °C; measured on demo board; unless otherwise specified.

Symbol Parameter

Conditions

Min Typ Max

VCC

supply voltage

ICC

supply current

3.0 3.3 3.6

9.8 12.5 15.2

Unit

V

mA

BGA2802

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 1 — 24 February 2011

© NXP B.V. 2011. All rights reserved.

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