SP3014-02UTG データシートの表示（PDF） - Littelfuse, Inc

部品番号

コンポーネント説明

メーカー

SP3014-02UTG

TVS Diode Arrays (SPA®Diodes) Low Capacitance ESD Protection

Littelfuse, Inc 

TVS Diode Arrays (SPA® Diodes)

Low Capacitance ESD Protection - SP3014 Series

Soldering Parameters

Reflow Condition

Pb – Free assembly

- Temperature Min (Ts(min))

Pre Heat - Temperature Max (Ts(max))

- Time (min to max) (ts)

Average ramp up rate (Liquidus) Temp (TL)

to peak

TS(max) to TL - Ramp-up Rate

Reflow

- Temperature (TL) (Liquidus)

- Temperature (tL)

Peak Temperature (TP)

Time within 5°C of actual peak

Temperature (tp)

Ramp-down Rate

Time 25°C to peak Temperature (TP)

Do not exceed

150°C

200°C

60 – 180 secs

3°C/second max

3°C/second max

217°C

60 – 150 seconds

260+0/-5 °C

20 – 40 seconds

6°C/second max

8 minutes Max.

260°C

Product Characteristics

Lead Plating

Pre-Plated Frame (µDFN)

Lead Material

Copper Alloy

Lead Coplanarity

0.0004 inches (0.102mm)

Substrate material

Silicon

Body Material

Molded Epoxy

Flammability

UL 94 V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte finish VDI 11-13.

TP

TL

TS(max)

TS(min)

25

Ramp-up

Preheat

tS

time to peak temperature

tP

Critical Zone

TL to TP

tL

Ramp-down

Time

Ordering Information

Part Number

SP3014-02UTG

Package

µDFN-6L

Marking

V H2

Min. Order Qty.

3000

Part Numbering System

SP 3014 – xx x T G

TVS Diode Arrays

(SPA® Diodes)

G= Green

Series

Number of

Channels

02 = 2 channel

T= Tape & Reel

Package

U= µDFN-6L

Part Marking System

V* *

Product Series

Number of

V = SP3014

Channels

Assembly Site 2 = 2 channel

© 2016 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 12/08/16

Share Link: