MX25L1606EZUI-12G データシートの表示（PDF） - Macronix International

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MX25L1606EZUI-12G

3V, 16M-BIT [x 1/x 2] CMOS SERIAL FLASH MEMORY

Macronix International 

MX25L1606E

(20) Read SFDP Mode (RDSFDP)...................................................................................................................... 25

Figure 3. Read Serial Flash Discoverable Parameter (RDSFDP) Sequence...................................................... 25

Table 8. Signature and Parameter Identification Data Values ............................................................................ 26

Table 9. Parameter Table (0): JEDEC Flash Parameter Tables.......................................................................... 27

Table 10. Parameter Table (1): Macronix Flash Parameter Tables..................................................................... 29

POWER-ON STATE.................................................................................................................................................... 31

ELECTRICAL SPECIFICATIONS............................................................................................................................... 32

ABSOLUTE MAXIMUM RATINGS...................................................................................................................... 32

Figure 4. Maximum Negative Overshoot Waveform........................................................................................... 32

CAPACITANCE TA = 25°C, f = 1.0 MHz.............................................................................................................. 32

Figure 5. Maximum Positive Overshoot Waveform............................................................................................. 32

Figure 6. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL............................................................... 33

Figure 7. OUTPUT LOADING............................................................................................................................ 33

Table 11. DC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V - 3.6V).... 34

Table 12. AC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V - 3.6V).... 35

Timing Analysis......................................................................................................................................................... 36

Figure 8. Serial Input Timing............................................................................................................................... 36

Figure 9. Output Timing....................................................................................................................................... 36

Figure 10. Hold Timing........................................................................................................................................ 37

Figure 11. WP# Disable Setup and Hold Timing during WRSR when SRWD=1................................................. 37

Figure 12. Write Enable (WREN) Sequence (Command 06).............................................................................. 38

Figure 13. Write Disable (WRDI) Sequence (Command 04)............................................................................... 38

Figure 14. Read Status Register (RDSR) Sequence (Command 05)................................................................. 39

Figure 15. Write Status Register (WRSR) Sequence (Command 01)................................................................ 39

Figure 16. Read Data Bytes (READ) Sequence (Command 03)....................................................................... 39

Figure 17. Read at Higher Speed (FAST_READ) Sequence (Command 0B).................................................... 40

Figure 18. Dual Output Read Mode Sequence (Command 3B).......................................................................... 41

Figure 19. Sector Erase (SE) Sequence (Command 20)................................................................................... 41

Figure 20. Block Erase (BE) Sequence (Command 52 or D8)........................................................................... 41

Figure 21. Chip Erase (CE) Sequence (Command 60 or C7)............................................................................ 42

Figure 22. Page Program (PP) Sequence (Command 02)................................................................................. 42

Figure 23. Deep Power-down (DP) Sequence (Command B9) ......................................................................... 43

Figure 24. Release from Deep Power-down (RDP) Sequence (Command AB)................................................ 43

Figure 25. Read Electronic Signature (RES) Sequence (Command AB)........................................................... 43

Figure 26. Read Identification (RDID) Sequence (Command 9F)....................................................................... 44

Figure 27. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90)............................... 44

Figure 28. Read Security Register (RDSCUR) Sequence (Command 2B)......................................................... 45

Figure 29. Write Security Register (WRSCUR) Sequence (Command 2F)........................................................ 45

Figure 30. Power-up Timing................................................................................................................................ 46

Table 13. Power-Up Timing ................................................................................................................................ 46

P/N: PM1548

REV. 1.8, JUN 04, 2015

3

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