AU80610004653AAS データシートの表示（PDF） - Intel

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AU80610004653AAS

Intel® Atom™ Processor N400 & N500 Series

Intel 

4.2

4.3

4.4

4.5

4.6

4.7

4.8

4.9

4.10

Decoupling Guidelines ........................................................................................38

4.2.1 Voltage Rail Decoupling ...........................................................................38

Processor Clocking .............................................................................................39

4.3.1 PLL Power Supply ...................................................................................39

Voltage Identification (VID).................................................................................39

Catastrophic Thermal Protection ..........................................................................41

Reserved or Unused Signals ................................................................................41

Signal Groups ...................................................................................................41

Test Access Port (TAP) Connection .......................................................................42

Absolute Maximum and Minimum Ratings..............................................................42

DC Specifications ...............................................................................................43

4.10.1 Voltage and Current Specifications ............................................................43

4.10.2 Interface DC Specifications ......................................................................47

5 Power Management .................................................................................................54

5.1 ACPI States Supported .......................................................................................54

5.1.1 System States........................................................................................54

5.1.2 Processor Idle States...............................................................................54

5.1.3 Integrated Graphics Display States ...........................................................55

5.1.4 Integrated Memory Controller States .........................................................55

5.1.5 DMI States ............................................................................................55

5.1.6 Interface State Combinations ...................................................................55

5.2 Processor Core Power Management ......................................................................56

5.2.1 Enhanced Intel SpeedStep® Technology ....................................................56

5.2.2 Dynamic Cache Sizing .............................................................................57

5.2.3 Low-Power Idle States.............................................................................57

5.2.4 Thread C-states Description .....................................................................60

5.2.5 Processor Core/Package C-states Description..............................................61

5.3 External Thermal Sensor PM_EXTTS1#: Implementation for Fast C4/C4E Exit ............64

6 Thermal Specifications and Design Considerations...................................................66

6.1 Thermal Specifications........................................................................................66

6.1.1 Thermal Diode........................................................................................67

6.1.2 Intel® Thermal Monitor ...........................................................................69

6.1.3 Digital Thermal Sensor ............................................................................71

6.1.4 Out of Specification Detection...................................................................72

6.1.5 PROCHOT# Signal Pin .............................................................................72

7 Package Mechanical Specifications and Ball Information..........................................74

7.1 Package Mechanical Specifications .......................................................................74

7.1.1 Package Mechanical Drawings...................................................................74

7.1.2 Package Loading Specifications .................................................................75

7.2 Processor Ballout Assignment ..............................................................................75

4

Intel Confidential

Specification Update

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