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MAPLAD6.5KP11A データシートの表示(PDF) - Microsemi Corporation

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MAPLAD6.5KP11A Datasheet PDF : 6 Pages
1 2 3 4 5 6
MPLAD6.5KP10A(e3) –
MPLAD6.5KP48CA(e3)
MAXIMUM RATINGS @ 25 oC unless otherwise specified
Parameters/Test Conditions
Symbol
Value
Junction and Storage Temperature
Thermal Resistance Junction-to-Ambient (1)
Thermal Resistance Junction-to-Case
Peak Pulse Power @ 10/1000 µs (2)
tclamping (0 volts to V(BR) min)
Unidirectional
Bidirectional
Forward Clamping Voltage @ 300 Amps (3)
Forward Surge Current (3)
Solder Temperature @ 10 s
Rated Average Power dissipation (5)
TA = 25 °C
TC = 100 °C
TJ and TSTG
R ӨJA
R ӨJC
P PP
V FS
I FSM
T SP
P M(AV)
-55 to +150
50
1.5
6,500
<100
<5
2.5
400
260
2.5 (1)
33.3 (4)
Notes: 1. When mounted on FR4 PC board with recommended mounting pad (see pad layout).
2. Also see figures 1 and 2. With impulse repetition rate (duty factor) of 0.05% or less.
3. At 8.3 ms half-sine wave (unidirectional devices only).
4. Case temperature controlled on heat sink as specified.
5. See MicroNote 134 for derating PPP when also applying steady-state power.
Unit
ºC/W
ºC/W
ºC/W
W
ps
ns
V
A
ºC
W
W
MECHANICAL and PACKAGING
CASE: Epoxy, meets UL94V-0.
TERMINALS: Tin/lead or matte-tin (fully RoHS compliant) plating.
MARKING: Part number.
DELIVERY option: Tape and reel (13 inch).
See Package Dimensions on last page.
Reliability Level*
M
MA
MX
MXL
*(see Hi-Rel Non-Hermetic
Product Portfolio)
Package Designation
PPP Rating (W)
PART NOMENCLATURE
M PLAD 6.5K P 7.0 CA (e3)
RoHS Compliance
e3 = RoHS compliant
Blank = non-RoHS compliant
Polarity
A = Unidirectional
CA = Bidirectional
Reverse Standoff Voltage
Plastic
RF01083, Rev A (4/5/13)
©2013 Microsemi Corporation
Page 2 of 6

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