List of figures
STM8S003F3 STM8S003K3
Figure 48.
Figure 49.
Figure 50.
Figure 51.
Figure 52.
Figure 53.
TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,
package footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
TSSOP20 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
UFQFPN20 - 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
UFQFPN20 - 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat
package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
UFQFPN20 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
STM8S003F3/K3 value line ordering information scheme(1) . . . . . . . . . . . . . . . . . . . . . . . 98
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DS7147 Rev 10