3223W-1-205M データシートの表示（PDF） - Bourns, Inc
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3223W-1-205M Datasheet PDF : 2 Pages
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3223 - 3 mm SMD Trimpot® Trimming Potentiometer
Packaging Specifications
J Style
(4.1.0559)MAX.
12.00 ± .30
(.472 ± .012)
1.75 ± .10
(.069 ± .004)
(4.1.7857)MAX.
(..00042)MAX.
4.42 ± 0.1
(.174 ± .004)
5.5 ± .05
(.217 ± .002)
1.5 + .10/ –.00
(.059 + .004/ –.000)
DIA.
2.00 ± .05
(.079 ± .002)
4.00 ± .10
(.157 ± .004)
1.5
(.059)
MIN.
4.26 ± .10
(.168 ± .004)
8.00 ± .10
(.315 ± .004)
G Style
(4.1.0559)MAX.
12.00 ± .30
(.472 ± .012)
1.75 ± .10
(.069 ± .004)
1.5 + .10/ –.00
(.059 + .004/ –.000)
DIA.
2.00 ± .05
(.079 ± .002)
4.00 ± .10
(.157 ± .004)
4.26 ± .10
(.168 ± .004)
(5.2.6242)MAX.
.04 MAX.
(.002)
5.3 ± 0.1
(.209 ± .004)
5.5 ± .05
(.217 ± .002)
1.5
(.059)
MIN.
Standard Resistance Table
Resistance
(Ohms)
10
20
50
100
200
500
1,000
2,000
5,000
10,000
20,000
50,000
100,000
200,000
500,000
1,000,000
2,000,000
Resistance
Code
100
200
500
101
201
501
102
202
502
103
203
503
104
204
504
105
205
Popular values listed in boldface. Consult factory
for special resistances.
8.00 ± .10
(.315 ± .004)
W Style
4.81
(.189)
MAX.
12.00 ± .30
(.472 ± .012)
1.75 ± .10
(.069 ± .004)
1.5 + .10/ –.00
(.059 + .004/ –.000)
DIA.
2.00 ± .05
(.079 ± .002)
4.00 ± .10
(.157 ± .004)
6.35
(.250)
MAX.
.04 MAX.
(.002)
4.5 ± 0.1
(.177 ± .004)
5.5 ± .05
(.217 ± .002)
1.78 ± .25 EQUAL SPACED
(.070 ± .010) 3 PLCS.
13.0 ± .51 DIA.
(.512 ± .020)
21.01 ± .79 DIA.
(.827 ± .031)
2.67 ± .25
(.105 ± .010)
59.18 ± 2.03
(2.330 ± .080)
1.5
(.059)
MIN.
8.00 ± .10
(.315 ± .004)
3.85 ± .10
(.152 ± .004)
178 ± 2.0
(7.008 ± .079)
DIA.
12.4 + 2.01/ -.000
(.488 + .079/ -.000)
REEL
Cover tape peel strength: Meets EIA specification 481.
DIMENSIONS:
MM
(INCHES)
TAPE
REV. 08/14
“Trimpot” is a registered trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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