MX25L6406EMI-12G データシートの表示（PDF） - Macronix International
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MX25L6406EMI-12G Datasheet PDF : 60 Pages
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MX25L6406E
Contents
1. FEATURES............................................................................................................................................................... 5
2. GENERAL DESCRIPTION...................................................................................................................................... 6
3. PIN CONFIGURATIONS .......................................................................................................................................... 7
4. PIN DESCRIPTION................................................................................................................................................... 7
5. BLOCK DIAGRAM.................................................................................................................................................... 8
6. MEMORY ORGANIZATION...................................................................................................................................... 9
Table 1. Memory Organization............................................................................................................................ 9
7. DEVICE OPERATION............................................................................................................................................. 10
Figure 1. Serial Modes Supported.................................................................................................................... 10
8. DATA PROTECTION............................................................................................................................................... 11
Table 2. Protected Area Sizes........................................................................................................................... 12
Table 3. 512 bit Secured OTP Definition........................................................................................................... 12
9. HOLD FEATURES.................................................................................................................................................. 13
Figure 2. Hold Condition Operation ....................................................................................................... 13
10. COMMAND DESCRIPTION.................................................................................................................................. 14
Table 4. COMMAND DEFINITION.................................................................................................................... 14
10-1. Write Enable (WREN)................................................................................................................................ 15
10-2. Write Disable (WRDI)................................................................................................................................. 15
10-3. Read Status Register (RDSR)................................................................................................................... 15
10-4. Write Status Register (WRSR)................................................................................................................... 16
Table 5. Protection Modes................................................................................................................................. 17
10-5. Read Data Bytes (READ)........................................................................................................................... 18
10-6. Read Data Bytes at Higher Speed (FAST_READ)..................................................................................... 18
10-7. Dual Output Mode (DREAD)...................................................................................................................... 18
10-8. Sector Erase (SE)...................................................................................................................................... 18
10-9. Block Erase (BE)........................................................................................................................................ 19
10-10. Chip Erase (CE)....................................................................................................................................... 19
10-11. Page Program (PP).................................................................................................................................. 19
10-12. Deep Power-down (DP)........................................................................................................................... 20
10-13. Release from Deep Power-down (RDP), Read Electronic Signature (RES) ........................................... 20
10-14. Read Identification (RDID)....................................................................................................................... 21
10-15. Read Electronic Manufacturer ID & Device ID (REMS)........................................................................... 21
Table 6. ID Definition......................................................................................................................................... 22
10-16. Enter Secured OTP (ENSO).................................................................................................................... 22
10-17. Exit Secured OTP (EXSO)....................................................................................................................... 22
10-18. Read Security Register (RDSCUR)......................................................................................................... 23
Table 7. Security Register Definition................................................................................................................. 23
10-19. Write Security Register (WRSCUR)......................................................................................................... 23
P/N: PM1577
REV. 1.8, NOV. 12, 2013
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