SMBJ5945B/TR13 データシートの表示（PDF） - Microsemi Corporation
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SMBJ5945B/TR13 Datasheet PDF : 5 Pages
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SMBG5913 – SMBG5956e3,
SMBJ5913 – SMBJ5956e3
Available
Silicon 2.0 Watt Zener Diodes
DESCRIPTION
The SMB(G/J)5913B – SMB(G/J)5956B series of surface mount 2.0 watt Zener diodes
provides a selection from 3.3 to 200 volts with tolerance options of 10%, 5% and 2%. This
series has the same electrical characteristics as the axial, JEDEC registered 1N5913 -
1N5956 series with the exception of its higher, 2.0 W power rating (versus 1.5 W for the
JEDEC series). This is permitted by the lower thermal resistance of the surface mount
packaging. The SMBG Gull-wing design in the DO-215AA package provides for visible solder
connections. The SMBJ J-bend design in the DO-214AA package permits greater PC board
mounting density. The series is available with SnPb plated leaded or RoHS compliant matte-
tin plating.
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• Surface mount equivalent to JEDEC registered 1N5913 thru 1N5956 number series but with a 30%
higher power rating.
• Ideal for high-density and low-profile mounting.
• Zener voltage available 3.3 V to 200 V.
• Standard voltage tolerances are plus/minus 10%, 5% and 2%.
• RoHS compliant versions available.
DO-215AA
Gull-wing Package
DO-214AA
J-bend Package
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
APPLICATIONS / BENEFITS
• Regulates voltage over a broad operating current and temperature range.
• Non-sensitive to ESD per MIL-STD-750 method 1020.
• Withstands high surge stresses (see figure 2).
• Minimal changes of voltage versus current.
• High specified maximum current (IZM) when adequately heat sunk.
• Moisture classification is Level 1 per IPC/JEDEC J-STD-020B with no dry pack required.
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead
Thermal Resistance Junction-to-Ambient (1)
Steady-State Power Dissipation @ TL < 80 oC (2)
Forward Voltage @ 200 mA
Solder Temperature @ 10 s
Symbol
TJ and TSTG
R ӨJL
R ӨJA
PD
VF
T SP
Value
-65 to +150
35
100
2.0
1.2
260
Unit
oC
oC/W
oC/W
W
V
oC
Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see last page).
2. Or 1.25 watts at TA = 25 ºC when mounted on FR4 PC board with recommended footprint (also see
figure 1.)
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
RF01101, Rev. A (1/10/13)
©2013 Microsemi Corporation
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