MXZ8-PW40-0000 データシートの表示（PDF） - Philips Electronics

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MXZ8-PW40-0000

Compact footprint delivering high-efficacy and just the right amount of light

Philips Electronics 

Reflow Soldering Characteristics

300

Tp: 260°C

250

TL: 217°C

200

Tsmax: 200°C

Tsmin: 150°C

150

100

Ramp-Up Rate, 3°C/sec. max.

260°C +0/-5°C

255°C +5/-0°C

ts: 60-120sec.

tp: 10-30sec. 30sec max.

tL: 60-150 sec,max

50

0

0

50

100

150

200

250

300

Time (seconds)

Temperature Profile for Table 5.

Table 5. Reflow Profile in Accordance with J-Std-020D.

Profile Feature

Preheat/Soak :

Temperature Min (Tsmin)

Temperature Max (Tsmax)

Maximum Time (ts) from Tsmin to Tsmax

Ramp-up Rate (TL to Tp )

Liquidous Temperature (T )

L

Maximum Time (t ) Maintained above T

L

L

Maximum Peak Package Body Temperature (Tp )

Time (tp ) within 5°C of the specified temperature (Tc )

Maximum Ramp-Down Rate (Tp to TL )

Maximum Time 25°C to Peak Temperature

Note for Table 5:

1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.

Lead Free Assembly

150°C

200°C

120 seconds

3°C / second

217°C

150 seconds

260°C

10-30 seconds

6°C / second

8 minutes

LUXEON 4014 Datasheet DS205 20140223 ©2014 Philips Lumileds Lighting Company.

5

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