LNK6663E(2014) データシートの表示（PDF） - Power Integrations, Inc

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LNK6663E
(Rev.:2014)

Energy Effcient, High-Power Off-Line Switcher with Accurate Primary-Side Regulation (PSR)

Power Integrations, Inc 

LinkSwitch™-HP Family

Energy Efficient, High-Power Off-Line Switcher

With Accurate Primary-Side Regulation (PSR)

Product Highlights

EcoSmart™- Energy Efficient

• Multi-mode control maximizes efficiency over full load range

• No-load consumption below 30 mW at 230 VAC (LNK67xx)

• >75% efficiency with 1 W input at 230 VAC

• >50% efficiency with 0.1 W input at 230 VAC

High Design Flexibility for Low System Cost

• Dramatically simplifies power supply designs

• Eliminates optocoupler and all secondary control circuitry

• ±5% or better output voltage tolerance

• 132 kHz operation reduces transformer and power supply size

• Accurate programmable current limit

• Compensation over line limits overload power

• Frequency jittering reduces EMI filter cost

• Fully integrated soft-start for minimum start-up stress

• 725 V MOSFET simplifies meeting derating requirements

(LNK677x)

• 650 V MOSFET for lowest system cost (LNK676x/LNK666x)

• Fast transient response family option (LNK666x)

Extensive Protection Features

• Auto-restart limits power delivery to 3% during overload faults

• Output short-circuit protection (SCP)

• Output overload/over-current protection (OPP, OCP)

• Optional extended shutdown delay time

• Output overvoltage protection (OVP), auto-restart or latching

• Line brown-in/out protection (line UV)

• Line overvoltage (OV) shutdown extends line surge withstand

• Accurate thermal shutdown (OTP), hysteretic or latching

Advanced Green Package Options

• eSIP™-7C package:

• Vertical orientation for minimum PCB footprint

• Simple heat sink mounting using clip or adhesive pad

• eSOP™-12B package:

• Low profile surface mounted for ultra-slim designs

• Heat transfer to PCB via exposed pad and SOURCE pins

• Supports either wave or IR reflow soldering

• eDIP™-12B package:

• Low profile through-hole mounted for ultra-slim designs

• Heat transfer to PCB via exposed pad or optional metal heat sink

• Extended creepage to DRAIN pin

• Heat sink is connected to SOURCE for low EMI

• Halogen free and RoHS compliant

Typical Applications

• LCD Monitor and TV

• Adapter

• Appliances

• Embedded power supplies (DVD, set-top box)

• Industrial

CONTROL

Figure 1. Typical Application Schematic.

Exposed

Pad

Exposed

Pad

eSIP-7C (E Package)

eSOP-12B (K Package)

eDIP-12B (V Package)

Figure 2. Package Options.

Output Power Table

Product4

230 VAC ±15%

Heat Sink

Adapter

Open

Frame

85-265 VAC

Adapter

Open

Frame

LNK6xx3K/V

LNK6xx3K

LNK6xx3E

LNK6xx4K/V

LNK6xx4K

LNK6xx4E

LNK6xx5K/V

LNK6xx5K

LNK6xx5E

LNK6xx6K/V

LNK6xx6K

LNK6xx6E

LNK6xx7K/V

LNK6xx7K

LNK6xx7E

PCB-W1

PCB-R2

Metal

PCB-W1

PCB-R2

Metal

PCB-W1

PCB-R2

Metal

PCB-W1

PCB-R2

Metal

PCB-W1

PCB-R2

Metal

15 W

21 W

21 W

16 W

22 W

30 W

19 W

26 W

40 W

21 W

30 W

60 W

25 W

36 W

853 W

25 W

35 W

35 W

28 W

39 W

47 W

30 W

42 W

593 W

34 W

48 W

883 W

41 W

59 W

1173 W

9W

12 W

13 W

11 W

15 W

20 W

13 W

18 W

26 W

15 W

22 W

40 W

19 W

27 W

55 W

15 W

21 W

27 W

20 W

28 W

36 W

22 W

31 W

45 W

26 W

37 W

683 W

30 W

43 W

903 W

Table 1. Output Power Table.

Notes:

1. PCB heat sink with wave soldering.

2. PCB heat sink with IR reflow soldering (exposed pad thermally connected to PCB).

3. Maximum power specified based on proper thermal dissipation.

4. Packages: E: eSIP-7C, K: eSOP-12B, V: eDIP-12B. See Table 2 for all device options.

www.powerint.com

This Product is Covered by Patents and/or Pending Patent Applications.

March 2014

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