74ALVT16827 データシートの表示（PDF） - NXP Semiconductors.
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74ALVT16827 Datasheet PDF : 16 Pages
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Philips Semiconductors
74ALVT16827
20-bit buffer/line driver; non-inverting; 3-state
13. Package outline
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm
SOT371-1
D
y
Z
56
pin 1 index
1
e
c
29
E
A
X
HE
vM A
A2
A1
28
wM
bp
Q
A
(A 3)
θ
Lp
L
detail X
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.8
0.4
0.2
2.35
2.20
0.25
0.3
0.2
0.22 18.55
0.13 18.30
7.6
7.4
0.635
10.4
10.1
1.4
1.0
0.6
1.2
1.0
0.25 0.18
0.1
0.85
0.40
8o
0o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT371-1
REFERENCES
JEDEC
JEITA
MO-118
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 8. Package outline SOT371-1 (SSOP56)
9397 750 15122
Product data sheet
Rev. 03 — 2 June 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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