Philips Semiconductors
74ALVT16827
20-bit buffer/line driver; non-inverting; 3-state
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm
SOT364-1
D
y
Z
56
E
A
X
c
HE
vM A
29
pin 1 index
1
e
A2
A1
28
wM
bp
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
L
Lp
Q
v
w
y
Z
θ
mm
1.2
0.15
0.05
1.05
0.85
0.25
0.28
0.17
0.2
0.1
14.1
13.9
6.2
6.0
0.5
8.3
7.9
1
0.8
0.4
0.50
0.35
0.25
0.08
0.1
0.5
0.1
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT364-1
REFERENCES
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 9. Package outline SOT364-1 (TSSOP56)
9397 750 15122
Product data sheet
Rev. 03 — 2 June 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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