LXZ2-2780-Y データシートの表示（PDF） - Philips Electronics

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LXZ2-2780-Y

Breakthrough luminance, design flexibility and optical control for Illumination solutions

Philips Electronics 

Solder Pad Design

Figure 3. Recommended PCB footprint for LUXEON Z ES for high

component count density based on solder mask defined pads. Dimensions in mm.

Figure 4. Solder pad layout for LUXEON Z.

Notes for Figures 3 and 4:

1. The drawing above shows the recommended solder pad layout on Printed Circuit Board (PCB).

2. Application Brief AB120 (LUXEON Z ES) and AB105 (LUXEON Z) provide the details of the PCB board layout design. In addition, the .dwg files are available at

www.philipslumileds.com and www.philipslumileds.cn.com.

LUXEON Z and LUXEON Z ES Datasheet DS120 20140326 ©2014 Philips Lumileds Lighting Company.

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