AD8138 データシートの表示（PDF） - Analog Devices

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AD8138

Low Distortion, Differential ADC Driver

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Supply Voltage

VOCM

Internal Power Dissipation

Operating Temperature Range

Storage Temperature Range

Lead Temperature (Soldering 10 sec)

Junction Temperature

Ratings

±5.5 V

±VS

550 mW

−40°C to +85°C

−65°C to +150°C

300°C

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, θJA is

specified for the device soldered in a circuit board in still air.

Table 6.

Package Type

8-Lead SOIC/4-Layer

8-Lead MSOP/4-Layer

θJA

Unit

121

°C/W

145

°C/W

Maximum Power Dissipation

The maximum safe power dissipation in the AD8138 packages

is limited by the associated rise in junction temperature (TJ) on

the die. At approximately 150°C, which is the glass transition

temperature, the plastic changes its properties. Even temporarily

exceeding this temperature limit can change the stresses that the

package exerts on the die, permanently shifting the parametric

performance of the AD8138. Exceeding a junction temperature

of 150°C for an extended period can result in changes in the

silicon devices, potentially causing failure.

AD8138

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

power is the voltage between the supply pins (VS) times the

quiescent current (IS). The load current consists of the differential

and common-mode currents flowing to the load, as well as

currents flowing through the external feedback networks and

internal common-mode feedback loop. The internal resistor tap

used in the common-mode feedback loop places a negligible

differential load on the output. RMS voltages and currents

should be considered when dealing with ac signals.

Airflow reduces θJA. In addition, more metal directly in contact

with the package leads from metal traces through holes, ground,

and power planes reduces the θJA.

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 8-lead SOIC

(121°C/W) and 8-lead MSOP (θJA = 145°C/W) packages on a

JEDEC standard 4-layer board. θJA values are approximations.

1.75

1.50

1.25

1.00

SOIC

0.75

MSOP

0.50

0.25

0

–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100 110 120

AMBIENT TEMPERATURE (°C)

Figure 3. Maximum Power Dissipation vs. Temperature

ESD CAUTION

Rev. G | Page 7 of 24

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