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B32911A3103K000 データシートの表示(PDF) - TDK Corporation

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B32911A3103K000
TDK
TDK Corporation TDK
B32911A3103K000 Datasheet PDF : 21 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
B32911*3 ... B32916*3
X1 / 330 V AC
1.3 General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
Recommendations
As a reference, the recommended wave soldering profile for our film capacitors is as follows:
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 21

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