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NLAST44599(2002) データシートの表示(PDF) - ON Semiconductor

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NLAST44599
(Rev.:2002)
ON-Semiconductor
ON Semiconductor ON-Semiconductor
NLAST44599 Datasheet PDF : 12 Pages
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NLAST44599
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
VIS
VIN
IIK
PD
TSTG
TL
TJ
MSL
Positive DC Supply Voltage
Analog Input Voltage (VNO or VCOM)
Digital Select Input Voltage
DC Current, Into or Out of Any Pin
Power Dissipation in Still Air
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Moisture Sensitivity
*0.5 to )7.0
V
*0.5 VIS VCC )0.5
V
*0.5 VI )7.0
V
$50
mA
TSSOP–16
450
mW
*65 to )150
_C
260
_C
150
_C
Level 1
FR
VESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 30% – 35% UL–94–VO (0.125 in)
Human Body Model (Note 1)
2000
V
Machine Model (Note 2)
200
Charged Device Model (Note 3)
1000
ILATCH–UP Latch–Up Performance
Above VCC and Below GND at 125_C (Note 4)
$300
mA
qJA
Thermal Resistance
TSSOP–16
164
_C/W
Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Extended exposure to these conditions
or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is
not implied. Functional operation should be restricted to the Recommended Operating Conditions.
1. Tested to EIA/JESD22–A114–A.
2. Tested to EIA/JESD22–A115–A.
3. Tested to JESD22–C101–A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
DC Supply Voltage
VIN
Digital Select Input Voltage
VIS
Analog Input Voltage (NC, NO, COM)
TA
Operating Temperature Range
tr, tf
Input Rise or Fall Time, SELECT
VCC = 3.3 V $ 0.3 V
VCC = 5.0 V $ 0.5 V
Min
2.0
GND
GND
*55
0
0
Max
5.5
5.5
VCC
)125
100
20
Unit
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
http://onsemi.com
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