ADA4932-1 データシートの表示（PDF） - Analog Devices

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ADA4932-1

Low Power Differential ADC Driver

Analog Devices 

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

Supply Voltage

Power Dissipation

Input Current, +IN, −IN, PD

Storage Temperature Range

Operating Temperature Range

ADA4932-1

ADA4932-2

Lead Temperature (Soldering, 10 sec)

Junction Temperature

Rating

11 V

See Figure 4

±5 mA

−65°C to +125°C

−40°C to +105°C

−40°C to +105°C

300°C

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational section of

this specification is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device

reliability.

THERMAL RESISTANCE

θJA is specified for the device (including exposed pad) soldered

to a high thermal conductivity 2s2p circuit board, as described

in EIA/JESD 51-7.

Table 8. Thermal Resistance

Package Type

ADA4932-1, 16-Lead LFCSP (Exposed Pad)

ADA4932-2, 24-Lead LFCSP (Exposed Pad)

θJA Unit

91 °C/W

65 °C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation in the ADA4932-x

package is limited by the associated rise in junction temperature

(TJ) on the die. At approximately 150°C, which is the glass

transition temperature, the plastic changes its properties. Even

temporarily exceeding this temperature limit can change the

stresses that the package exerts on the die, permanently shifting

the parametric performance of the ADA4932-x. Exceeding a

junction temperature of 150°C for an extended period can result

in changes in the silicon devices, potentially causing failure.

ADA4932-1/ADA4932-2

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive. The quiescent power is the voltage

between the supply pins (VS) times the quiescent current (IS).

The power dissipated due to the load drive depends upon the

particular application. The power due to load drive is calculated

by multiplying the load current by the associated voltage drop

across the device. RMS voltages and currents must be used in

these calculations.

Airflow increases heat dissipation, effectively reducing θJA. In

addition, more metal directly in contact with the package leads/

exposed pad from metal traces, through holes, ground, and power

planes reduces θJA.

Figure 4 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the single 16-lead

LFCSP (91°C/W) and the dual 24-lead LFCSP (65°C/W) on a

JEDEC standard 4-layer board with the exposed pad soldered to

a PCB pad that is connected to a solid plane.

3.5

3.0

2.5

ADA4932-2

2.0

1.5

ADA4932-1

1.0

0.5

0

–40

–20

0

20

40

60

80

100

AMBIENT TEMPERATURE (°C)

Figure 4. Maximum Power Dissipation vs. Ambient Temperature for

a 4-Layer Board

ESD CAUTION

Rev. A | Page 7 of 28

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