MMA02040C8200FB300 データシートの表示（PDF） - Vishay Semiconductors
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MMA02040C8200FB300 Datasheet PDF : 15 Pages
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MMU 0102, MMA 0204, MMB 0207 - Professional
www.vishay.com
Vishay Beyschlag
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2 (1)
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
STABILITY
CLASS 0.25
OR BETTER
STABILITY
CLASS 0.5
OR BETTER
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
MMU 0102 10 to 221 k 1 to < 10
<1
> 221 k
MMA 0204 10 to 332 k 1 to < 10
<1
> 332 k
MMB 0207 10 to 1 M 1 to < 10
<1
> 1 M
4.39
Periodic
electric
overload:
-
Standard
operation
mode
U = 15 x P70 x R or
U = 2 x Umax.;
whichever is the less severe;
Periodic
electric
0.1 s on; 2.5 s off;
overload:
1000 cycles
Power
operation
mode
± (0.5 % R + 5 m)
± (1 % R + 5 m)
Endurance by sweeping;
4.22
6 (Fc)
Vibration
10 Hz to 2000 Hz;
no resonance; amplitude
1.5 mm or 200 m/s2; 7.5 h
4.38
-
Electrostatic
discharge
(Human Body
Model)
IEC 61340-3-1 (1);
3 pos. + 3 neg. discharges
MMU 0102: 1.5 kV
MMA 0204: 2 kV
MMB 0207: 4 kV
±(0.05 % R + 5 m)
± (0.5 % R + 0.05 )
±(0.1 % R
+ 5 m)
Solder bath method;
SnPb40;
non-activated flux;
4.17
58 (Td) Solderability
(215 ± 3) °C; (3 ± 0.3) s
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning ( 95 % covered); no visible damage
Good tinning ( 95 % covered); no visible damage
Solder bath method;
±(0.05 % R
±(0.1 % R
±(0.25 % R ±(0.25 % R
Resistance
(260 ± 5) °C; (10 ± 1) s
+ 10 m)
+ 10 m)
+ 10 m)
+ 10 m)
4.18
58 (Td)
to soldering
heat
Reflow method 2
(IR/forced gas convection);
(260 ± 5) °C; (10 ± 1) s
±(0.02 % R
+ 10 m)
±(0.05 % R
+ 10 m)
±(0.05 % R
+ 10 m)
±(0.1 % R
+ 10 m)
Component
4.29
45 (XA)
solvent
resistance
Isopropyl alcohol;
50 °C; method 2
No visible damage
4.30
45 (XA)
Solvent
resistance
of marking
Isopropyl alcohol;
50 °C; method 1, toothbrush
Marking legible; no visible damage
4.32
21 (Ue3)
Shear
(adhesion)
45 N
No visible damage
4.33
21 (Ue1)
Substrate
bending
Depth 2 mm,
3 times
No visible damage, no open circuit in bent position
± (0.05 % R + 5 m) (2)
4.7
4.35
-
Voltage proof
URMS = Uins; 60 s
-
Flammability
IEC 60695-11-5 (1),
needle flame test; 10 s
No flashover or breakdown
No burning after 30 s
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
(2) Special requirements apply to MICRO-MELF, MMU 0102:
• R < 100 ± (0.25 % R + 10 m)
• 100 R 221 k ± 0.1 % R
• 221 k < R: ± 0.25 % R
Revision: 06-Apr-18
11
Document Number: 28713
For technical questions, contact: melf@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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