FTP540 データシートの表示（PDF） - InPower Semiconductor
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FTP540 Datasheet PDF : 10 Pages
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Part’s Name
Limit
Lead Frame
Molding Compound
Chip
Wire Bonding
Solder
Pb
≤0.1%
○
○
○
○
×
Hazardous
Hg
≤0.1%
Cd
≤0.01%
○
○
○
○
○
○
○
○
○
○
Substance
Cr(VI)
≤0.1%
PBB
≤0.1%
○
○
○
○
○
○
○
○
○
○
PBDE
≤0.1%
○
○
○
○
○
Note
○：Means the hazardous material is under the criterion of SJ/T11363-2006.
×：Means the hazardous material exceeds the criterion of SJ/T11363-2006.
The plumbum element of solder exist in products presently, but within
the allowed range of Eurogroup’s RoHS.
©2009 InPower Semiconductor Co., Ltd.
Page 9 of 10
FTP540 Preliminary. Mar. 2009
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