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HI-2579 データシートの表示(PDF) - Holt Integrated Circuits

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HI-2579 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
PACKAGE DIMENSIONS
HI-2579, HI-2581
Bottom View
.060 TYP.
(1.52)
24X
.025
(.64)
.660 ± .007
(16.76 ± .18)
.218
(5.54)
Dimensions in inches (mm)
.044 SQ. 6X
(1.12 SQ.)
R.017 24X
(R.43)
24X
R.008
(R.20)
PIN 1 INDEX
.510 ± .007
(12.95 ± .18)
.600 ± .007
(15.24 ± .18)
Notes:
1. Heatsink pad is electrically isolated from the IC die and may be connected to the board’s VDD or GND plane to remove heat.
2. The “keep out” zones (crosshatched) enclose test pads for the transformer primary windings. DO NOT CONNECT.
3. Routing traces under test pads is not recommended.
HOLT INTEGRATED CIRCUITS
10

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