AIC1952 データシートの表示（PDF） - Analog Intergrations
部品番号
コンポーネント説明
メーカー
AIC1952 Datasheet PDF : 13 Pages
| |||
AIC1952
APPLICATION INFORMATION
The AIC1952 is a low-dropout, low quiescent-current,
dual-output linear regulator for battery power
applications. These parts are available with preset
output voltages ranging from 0.8V to 3.8V, and the
parts can supply loads up to 300mA.
SHUTDOWN
The AIC1952 has two independent shutdown control
inputs (EN1 and EN2). By connecting EN1 pin to
ground, output1 can be shut down. By connecting
EN2 pin to ground, output2 can be shut down. By
connecting both of EN1 pin and EN2 pin to ground,
the AIC1952 can be shut down to reduce the supply
current to 0.1A.
CURRENT LIMIT
The AIC1952 includes two independent current
limiters, which monitor and control the maximum
output current. If the output is overloaded or shorted
to ground, this can protect the device from being
damaged.
THERMAL PROTECTION
The AIC1952 includes a thermal-limiting circuit, which
is designed to protect the device against overload
condition. When the junction temperature exceeds
TJ=150ºC, the thermal-limiting circuit turns off the
pass transistors and allows the IC to cool. For
continuous load condition, maximum rating of junction
temperature must not be exceeded.
INPUT-OUTPUT CAPACITORS
Linear regulators require input and output capacitors
to maintain stability. Input capacitor at 1F with a 1F
ceramic output capacitor for each regulator is
recommended. When choosing the input and output
ceramic capacitors, X5R and X7R types are
recommended because they retain their capacitance
over wider ranges of voltage and temperature than
other types.
POWER DISSIPATION
The maximum power dissipation of AIC1952
depends on the thermal resistance of its case and
circuit board, the temperature difference between the
die junction and ambient air, and the rate of airflow.
The rate of temperature rise is greatly affected by the
mounting pad configuration on the PCB, the board
material, and the ambient temperature. When the IC
mounting with good thermal conductivity is used, the
junction temperature will be low even when large
power dissipation applies.
The power dissipation across the device is
P = IOUT1 (VIN-VOUT1)+ IOUT2 (VIN-VOUT2)
The maximum power dissipation is:
PMAX
(TJ-max - TA )
Rθ JA
Where TJ-max is the maximum allowable junction
temperature (150C), and TA is the ambient
temperature suitable in application.
As a general rule, the lower temperature is, the better
reliability of the device is. So the PCB mounting pad
should provide maximum thermal conductivity to
maintain low device temperature.
11
Share Link: 