MMBZ5246ELT1G(2016) データシートの表示（PDF） - ON Semiconductor
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MMBZ5246ELT1G Datasheet PDF : 7 Pages
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MMBZ52xxELT1G Series,
SZMMBZ52xxELT1G Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Features
• 225 mW Rating on FR−4 or FR−5 Board
• Zener Voltage Range − 2.4 V to 91 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Peak Power − 225 W (8 x 20 ms)
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• Pb−Free Packages are Available
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MAXIMUM RATINGS
Rating
Symbol Max
Unit
Peak Power Dissipation @ 20 ms (Note 1)
Ppk
@ TL ≤ 25°C
Total Power Dissipation on FR−5 Board,
PD
(Note 2) @ TA = 25°C
Derated above 25°C
225
W
225
mW
1.8 mW/°C
Thermal Resistance, Junction−to−Ambient
Total Power Dissipation on Alumina
Substrate, (Note 3) @ TA = 25°C
Derated above 25°C
RqJA
PD
556
°C/W
300
mW
2.4 mW/°C
Thermal Resistance, Junction−to−Ambient RqJA
Junction and Storage Temperature Range TJ, Tstg
417
−65 to
+150
°C/W
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Nonrepetitive current pulse per Figure 9.
2. FR−5 = 1.0 X 0.75 X 0.62 in.
3. Alumina = 0.4 X 0.3 X 0.024 in., 99.5% alumina.
© Semiconductor Components Industries, LLC, 2003
1
October, 2016 − Rev. 8
www.onsemi.com
3
Cathode
1
Anode
MARKING
DIAGRAM
3
1
2
SOT−23
CASE 318
STYLE 8
Bxx M G
G
1
Bxx = Device Code
xx = (Refer to page 2)
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package Shipping†
MMBZ52xxELT1G
SOT−23 3000 / Tape &
(Pb−Free)
Reel
SZMMBZ52xxELT1G SOT−23 3000 / Tape &
(Pb−Free)
Reel
MMBZ52xxELT3G
SOT−23 10000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
Publication Order Number:
MMBZ5221ELT1/D
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