TC1015EV データシートの表示（PDF） - TelCom Semiconductor, Inc

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TC1015EV

300mA CMOS LDO

TelCom Semiconductor, Inc 

300mA CMOS LDO

TC1108

Actual power dissipation:

PD ≈ (VINMAX – VOUTMIN)ILOADMAX

= [(3.3 x 1.1) – (2.7 x .995)]275 x 10-3

= 260mW

Maximum allowable power dissipation:

PDMAX =

(TJMAX – TAMAX)

␪JA

= (125 – 95)

59

= 508mW

In this example, the TC1108 dissipates a maximum of

only 260mW; far below the allowable limit of 508mW. In a

similar manner, Equation 1 and Equation 2 can be used to

calculate maximum current and/or input voltage limits. For

example, the maximum allowable VIN is found by substitut-

ing the maximum allowable power dissipation of 508mW

into Equation 1, from which VINMAX = 4.6V.

MARKINGS

3-Pin SOT-223

ቢ part number code

ባ represents temperature + date code + lot Identity +

subcontractor identity

TC1108 (V)

TC1108-2.5VDB

TC1108-2.8VDB

TC1108-3.0VDB

TC1108-3.3VDB

TC1108-5.0VDB

Code

110825

110828

110830

110833

110850

TAPING FORM

Device

Marking

Component Taping Orientation for 3-Pin SOT-223 Devices

PIN 1

User Direction of Feed

User Direction of Feed

Device

Marking

W

PIN 1

Standard Reel Component Orientation

for TR Suffix Device

(Mark Right Side Up)

P

Reverse Reel Component Orientation

for RT Suffix Device

(Mark Upside Down)

Carrier Tape, Number of Components Per Reel and Reel Size

Package

3-Pin SOT-223

Carrier Width (W)

12 mm

Pitch (P)

8 mm

Part Per Full Reel

4000

Reel Size

13 in

TC1108-2 1/25/00

5

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