ZXLD1320EV1 データシートの表示（PDF） - Diodes Incorporated.
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ZXLD1320EV1 Datasheet PDF : 8 Pages
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ZXLD1320EV1
Layout considerations
The PCB tracks should be kept as short as possible to minimize ground bounce, and the ground pin of the device
should be soldered directly to the ground plane. It is particularly important to mount the coil and the input/output
capacitors close to the device to minimize parasitic resistance and inductance, which will degrade efficiency.
Precautions should be taken to avoid noise entering the VIN pin. Input decoupling capacitor C2, between VIN
and GND, should be kept as close as possible to the device. Enough copper should be attached to the GND pin
(exposed pad) for heat-sinking purposes. In this evaluation board, the copper area is on the bottom layer,
connected to the exposed pad through several vias.
Below is the recommended layout of the ZXLD1320EV1.
Top Silk
Top Copper
Bottom Copper
Issue 2 - February 2008
© Zetex Semiconductors plc, 2008
5
Drill File
www.zetex.com
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