AH102A データシートの表示（PDF） - WJ Communications => Triquint

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AH102A

Medium Power, High Linearity Amplifier

WJ Communications => Triquint 

AH102A

Medium Power, High Linearity Amplifier

AH102A-G (Green / Lead-free SOT-89 Package) Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded

(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.

Outline Drawing

Product Marking

The AH102A-G will be marked with a

“102AG” designator and an alphanumeric lot

code. The obsolete tin-lead package is marked

with a “102A” designator with an alphanumeric

lot code and a “0” on the right side of the

device.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

Land Pattern

MSL / ESD Rating

ESD Rating: Class 1C

Value:

Passes ≥ 1000V min.

Test:

Human Body Model (HBM)

Standard: JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value:

Passes ≥ 1000V min.

Test:

Charged Device Model (CDM)

Standard: JEDEC Standard JESD22-C101

MSL Rating: Level 3 at +260 °C convection reflow

Standard: JEDEC Standard J-STD-020

Mounting Config. Notes

Thermal Specifications

Parameter

Rating

1000

Operating Case Temperature

Thermal Resistance, Rth (1)

Junction Temperature, Tjc (2)

-40 to +85 °C

25 °C / W

100

130 °C

MTTF vs. GND Tab Temperature

1. Ground / thermal vias are critical for the proper

performance of this device. Vias should use a .35mm

(#80 / .0135”) diameter drill and have a final plated thru

diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers

near the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the

board to a heatsink. Ensure that the ground / thermal via

region contact the heatsink.

4. Do not put solder mask on the backside of the PC board in

the region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in

degrees.

1. The thermal resistance is referenced from the hottest

part of the junction to the ground tab (pin 4).

2. This corresponds to the typical biasing condition of

+9V, 200 mA at an 85 °C case temperature. A

minimum MTTF of 1 million hours is achieved for

junction temperatures below 160 °C.

10

1

60 70 80 90 100 110 120

Tab Temperature (°C)

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com

Page 5 of 5 June 2007

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