Monolithic Power Systems
MP1583
3A, 23V
Step Down Converter
Packaging
SOIC8 or SOIC8N (Exposed Pad)
(With or without Exposed Pad)
PIN 1 IDENT.
0.229(5.820)
0.244(6.200)
NOTE 2
0.150(3.810)
0.157(4.000)
0.013(0.330)
0.020(0.508)
0.050(1.270)BSC
0.0075(0.191)
0.0098(0.249)
SEE DETAIL "A"
0.011(0.280) x 45o
0.020(0.508)
0.053(1.350)
0.068(1.730)
0.189(4.800)
0.197(5.004)
0o-8o
0.049(1.250)
0.060(1.524)
SEATING PLANE
0.001(0.030)
0.004(0.101)
NOTE:
1) Control dimension is in inches. Dimension in bracket is millimeters.
2) Exposed Pad Option Only (N-Package) ; 2.55+/- 0.25mm x 3.38 +/- 0.44mm.
Recommended Solder Board Area: 2.80mm x 3.82mm = 10.7mm2 (16.6mil2)
0.016(0.410)
0.050(1.270)
PDIP8
DETAIL "A"
NOTICE: MPS believes the information in this document to be accurate and reliable. However, it is subject to change
without notice. Please contact the factory for current specifications. No responsibility is assumed by MPS for its use or fit to
any application, nor for infringement of patent or other rights of third parties
MP1583 Rev 2.0
Monolithic Power Systems, Inc.
11
06/30/04
983 University Ave, Building A, Los Gatos, CA 95032 USA
© 2004 MPS, Inc.
Tel: 408-357-6600 ♦ Fax: 408-357-6601 ♦ Web: www.monolithicpower.com