935267053005 データシートの表示（PDF） - Philips Electronics
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935267053005 Datasheet PDF : 22 Pages
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Product Specification
1 Contents
SL1 ICS31 01
Rev. 1.2
1 CONTENTS
2
2 DEFINITIONS
4
2.1 Life Support Applications .................................................................................................... 4
2.2 Abbreviations ........................................................................................................................ 4
3 SCOPE
5
4 ORDERING INFORMATION
5
5 FUNCTIONAL DESCRIPTION
6
5.1 Basic Features ....................................................................................................................... 6
5.2 Block Diagram of the IC....................................................................................................... 6
5.3 Memory Organisation........................................................................................................... 7
5.3.1 Serial Number................................................................................................................... 7
5.3.2 Write Access Conditions .................................................................................................. 7
5.3.3 Special Functions (EAS/QUIET)..................................................................................... 8
5.3.4 Family Code and Application Identifier........................................................................... 8
5.3.5 Configuration of delivered ICs......................................................................................... 8
6 MECHANICAL DIE SPECIFICATIONS
9
7 MECHANICAL WAFER SPECIFICATIONS
10
7.1 Wafer Status ........................................................................................................................ 10
7.2 Backside Treatment ............................................................................................................ 10
8 DOCUMENTATION
11
8.1 Delivery Documentation..................................................................................................... 11
8.2 Fail-Die Identification......................................................................................................... 11
8.2.1 Ink Dot Specification...................................................................................................... 11
8.2.2 Wafer Mapping............................................................................................................... 11
9 QUALITY ASSURANCE
12
9.1 Electrical Acceptance Test................................................................................................. 12
9.2 Visual Inspection................................................................................................................. 12
9.2.1 After Wafer Final Test.................................................................................................... 12
9.2.2 After Sawing (Film Frame Carrier)................................................................................ 12
10 PACKING
13
10.1 Storage Recommendations ................................................................................................. 13
10.2 Possible Forms of Delivery ................................................................................................. 13
10.2.1 Packing of Unsawn Wafers............................................................................................ 13
10.2.2 Packing of Sawn Wafers ................................................................................................ 13
July 2000
Page 2 of 22
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