935267050025 データシートの表示（PDF） - Philips Electronics
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935267050025 Datasheet PDF : 22 Pages
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Product Specification
3 Scope
SL1 ICS31 01
Rev. 1.2
This specification describes the electrical, physical and dimensional properties of unsawn and sawn
wafers on FFC of I•CODE1 Label ICs (Cres = 97 pF) on a Philips 6C15 IDFW process and is the
base for delivery of tested I•CODE1 Label ICs.
General recommendations are given for storage, handling and processing of wafers as well as
assembly of labels.
Reference documents:
MIL-STD 883D Method 3023
MIL-STD 883D Method 3015
SNW-FQ-627
PICTOH-QS007
General Specification for 6” Wafer
General Quality Specification
I•CODE Label IC, Coil Design Guide
This product specification is valid for mask revision: VCOL1V0 NK: O MB: B
4 Ordering Information
Following ordering options are available:
Type Name
SL1 ICS31 01W/N5D
SL1 ICS31 01U/N5D
SL1 ICS31 01U/L6D
Description
Sawn wafer on foil (FFC), 150 µm, inked and mapped
Unsawn wafer, 150 µm, inked and mapped
Unsawn wafer, 525 µm, mapped (not inked)
Ordering Code
9352 670 53005
9352 670 50025
9352 670 59025
July 2000
Page 5 of 22
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